Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly
Durable JEDEC IC Tray keeps semiconductor components clean by reducing dust buildup during packaging and assembly. Sturdy build withstands frequent handling, shielding parts from scratches and impacts.
Durable JEDEC IC Tray follows JEDEC standards, ensuring smooth integration with automated production lines. It lowers component damage rates, supporting consistent quality across manufacturing stages.
Durable JEDEC IC Tray fits diverse component sizes with customizable cavities. Whether for high-volume runs or precision assembly, it delivers reliable, dust-free protection for sensitive electronic parts.
Key Features/ Benefits
- Deliver durable construction.
- Dust reduction and anti-contamination
- Customizable cavity layouts
- Secure component retention
- JEDEC standard compliance
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 10x23=230 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Durable JEDEC IC Tray works perfectly for semiconductor packaging lines, IC assembly facilities, and clean room manufacturing. It prevents dust contamination, preserving component purity during high-precision production.
Durable JEDEC IC Tray also supports in-process handling and storage, offering stable protection between production steps. Custom cavities hold components firmly, minimizing shifting and damage during automated assembly operations.
Packaging & Shipping/ Services
Durable JEDEC IC Tray offers full customization to match unique production requirements. Adjust cavity size, pitch, and layout to fit specific component dimensions and automated line workflows.
Engineering team collaborates closely to develop tailored tray solutions, from prototype to mass production. Add custom markings, mounting holes, or anti-slip features to optimize dust control and handling efficiency in packaging and assembly.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / Waffle Pack Trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu