Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC Storage
Price:
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable Waffle Pack Chip Trays featuring Uniform Grids for Safe Fine Pitch IC Storage
Searching for reliable packaging to safeguard delicate fine pitch ICs?
Built with evenly spaced grid compartments to firmly lock components. Prevent chips from shifting and collision during handling, transit and storage.
Deliver steady anti-static performance to shield sensitive semiconductors. Fit repeated circulation inside electronic manufacturing workshops.
Support flexible structural adjustments to match diverse chip dimensions. Meet varied packaging demands across semiconductor and electronics industries.
Key Features/ Benefits
- Reliable ESD protection for sensitive semiconductor parts
- Precise grid cavities for stable component holding
- Stackable layout to save storage and shipping space
- Support fully customized cavity sizes and layout designs
- Precise waffle structure.
Specifications
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4mm | ||
| Matrix QTY | 11x7=77 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Perfect for storing and transporting integrated circuits, chips, sensors and other precision microelectronic components. Effectively guard fragile fine-pitch devices against static damage and physical abrasion in every workflow.
Widely adopted by semiconductor factories, electronic component suppliers and SMT assembly workshops. Suitable for chip inspection, production turnover, finished goods storage and cross-regional shipment of electronic parts.
Packaging & Shipping/ Services
Adopt scientific stacking method to avoid extrusion and deformation of trays. Outer carton packaging with buffer materials reduces impact risks during long-distance ocean and air freight.
Flexible packing quantity can be arranged according to your order scale. Strict packing standard ensures intact delivery. Stable packaging solution fits regular bulk shipments for global semiconductor buyers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / Waffle Pack Trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu