Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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Heat-Resistant Anti-Static Waffle Pack Trays with Customizable Cavity Sizes for Semiconductor IC Chips

Price Negotiable
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
MOQ: 500 pcs
Delivery Time: 10 workdays
Brand: Hiner-pack
Product Description
Heat‑Resistant Anti‑Static Waffle Pack Trays for Semiconductor IC Chips

Block static discharge that damages delicate semiconductor components. Maintain stable shape under repeated high‑temperature process cycles. Searching for dependable carriers for precision IC units? Stand up to rigorous conditions inside high‑output production workshops.


Hold precision chips within engraved grid cavities. Prevent displacement and surface scratches during handling operations. Lower component rejection risks caused by static shock and physical impact. Deliver steady protective performance across full production sequences.


Endure repeated stacking and frequent loading‑unloading cycles. Keep consistent dimensional performance amid continuous mass‑volume usage. Satisfy strict protection requirements for semiconductor assembly and test workflows.

Key Features/ Benefits 
  • ESD protection
  • High temperature resistance
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25013
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 10.2x4.2x0.45 mm
Matrix QTY 50.7×50.7×4 mm
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Serve semiconductor assembly, chip sorting and performance testing. Protect precision IC parts through thermal treatment, inspection and transit phases. Cut loss brought by static electricity and mechanical abrasion.


Fit component warehouses and electronics OEM production sites. Provide safe containment for varied precision semiconductor parts during large‑batch handling tasks.

Packaging & Shipping/ Services

Use heavy‑duty corrugated cartons paired with shock‑absorbent inner fillers for finished goods. Apply firm strapping to avoid squeezing or shifting inside packages. Take extra care for semiconductor‑grade goods to eliminate risk of deformation or surface scratch before shipment.


Arrange air, sea or express delivery strictly based on shipping instructions from buyers. Generate full‑set shipping papers once goods depart warehouse. Track cargo movement actively and feed latest logistics status to overseas clients throughout whole delivery cycle.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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