Reusable Waffle Pack Chip Trays with Uniform Grids for Fine-Pitch IC Protection
Lock fragile fine‑pitch IC parts inside precision grid cavities. Prevent tiny semiconductor units from sliding amid frequent handling work. Hunting for dependable carriers for miniature chips? Sustain stable performance over countless working cycles.
Defend chips against collision and surface scratch throughout manufacturing flows. Cut scrap risks caused by random component movement. Adapt well to high‑speed production workflows without extra modification. Keep chip placement steady in testing, checking and transfer procedures.
Allow stacked placement to conserve valuable factory workspace. Maintain accurate dimensions under long‑term heavy‑duty usage. Satisfy strict holding standards for sophisticated semiconductor assembly processes.
- Reliable ESD protection for sensitive semiconductor parts
- Precise grid cavities for stable component holding
- Precision grids for accurate component alignment
- Support fully customized cavity sizes and layout designs
- Precise waffle structure.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4mm | ||
| Matrix QTY | 6x10=60 PCS | ||
| Service | Accept OEM, ODM | ||
Handle fine‑pitch IC sorting, performance testing and component assembly work. Shield miniature semiconductor chips during inspection and intra‑factory transfer. Minimize losses resulting from part displacement and surface damage.
Work within electronics production plants and component inventory areas. Provide dependable holding solution for multiple precision chips during large‑batch processing assignments.
Seal every lot with anti‑static inner bags before loading heavy‑duty export cartons. Fill cushion materials to guard goods against squeeze damage. Carry out full‑item checking before dispatching semiconductor‑grade products.
Arrange sea freight, air freight or courier service per buyers’ confirmed shipping plans. Issue full shipping paperwork once goods leave warehouse. Share latest logistics status timely with overseas purchasers.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / Waffle Pack Trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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