Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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ABS Black Waffle Pack Chip Trays - 2" to 4" Antistatic IC Packaging with 10⁴-10¹¹Ω Resistance

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

ABS Black Waffle Pack Chip Trays are precision-engineered square antistatic packaging solutions designed specifically for IC chips and electronic components. These embossed plastic trays feature customizable cavities to securely hold delicate parts during transport and handling.

Key Features
  • Compact design with light weight for reduced transportation costs
  • High-capacity trays suitable for chip transfer and testing applications
  • Stable antistatic performance with surface resistance range of 10⁴-10¹¹Ω
  • Excellent flatness (max 0.3mm) for automated equipment compatibility
  • Compatible with matching covers and clips for secure shipping
  • Recyclable plastic materials with environmental compliance
  • Stackable design for maximum space utilization
Applications

Ideal for wafer die, bar chips, PCBA module components, electronic component packaging, and optical device packaging applications.

Technical Specifications
Outline Size Material Options Surface Resistance Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.3mm Customizable
Custom sizes ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω TBC Customizable
Quality Assurance
  • ISO certified manufacturing facility
  • RoHS compliant materials
  • 10+ years of export experience
  • Professional engineering and design support
  • Support for small batch production
  • Global export to USA, Germany, UK, Korea, Japan, and more
Product Images
ABS Black Waffle Pack Chip Tray design and specifications Die placement demonstration on waffle pack tray Waffle pack tray with electronic components
Frequently Asked Questions
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities with extensive experience in mass production of various IC trays.
Q: How long is your delivery time?
A: Typically 5-8 working days, depending on order quantity and specifications.
Q: Do you provide samples? Is it free or extra?
A: Yes, we provide samples. Sample costs vary by product value, with shipping costs typically collected or as agreed.
Q: What kind of Incoterms can you do?
A: We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other agreed incoterms.
Q: What method can you use to ship the goods?
A: Shipping options include sea freight, air freight, express delivery, or postal service based on order quantity and volume.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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