Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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ROHS Black PC Waffle Pack Chip Trays 2-inch and 4-inch with 0.2mm Flatness for Electronic Die Protection

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
ROHS Compliant Anti-Static Waffle Pack Chip Trays

These precision-engineered waffle pack trays provide superior protection and organization for semiconductor devices, electronic dies, and sensitive components during transportation and storage.

Key Advantages
  • Compact design with light weight reduces transportation costs
  • High-capacity trays suitable for chip transfer and testing applications
  • Stable anti-static performance with surface resistance of 10⁴-10¹¹Ω
  • Excellent flatness (max 0.2mm-0.3mm) for automated equipment compatibility
  • Compatible with matching covers and clips for secure shipping
  • Recyclable plastic materials with environmental-friendly properties
  • Stackable design maximizes storage space utilization
Technical Specifications
Outline Size Material Surface Resistance Flatness Color
2-inch ABS, PC, PPE, etc. 10⁴-10¹¹Ω Max 0.2mm Customizable
3-inch ABS, PC, PPE, etc. 10⁴-10¹¹Ω Max 0.25mm Customizable
4-inch ABS, PC, PPE, etc. 10⁴-10¹¹Ω Max 0.3mm Customizable
Custom sizes ABS, PC, PPE, etc. 10⁴-10¹¹Ω To be confirmed Customizable
Product Details

Cavity Size: Customized dimensions available

Materials: ABS, PC, MPPO, PPE and other acceptable options

Features: Durable construction, reusable design, eco-friendly, biodegradable

Minimum Order Quantity: 500 pieces

Delivery Time: 8-10 working days standard

Applications

Ideal for wafer die, bar chips, PCBA modules, electronic components, and optical device packaging requirements.

Product Images
ROHS compliant black waffle pack chip tray for electronic components Close-up view of waffle pack tray cavities for semiconductor chips Stackable waffle pack trays for efficient storage and transportation
Frequently Asked Questions

Q: Do you offer OEM and custom design services?
A: Yes, we provide comprehensive OEM/ODM services with strong mold manufacturing and design capabilities.

Q: What is your standard delivery time?
A: Typically 5-8 working days, depending on order quantity.

Q: Do you provide samples?
A: Yes, we offer samples which may be free or charged based on product value.

Q: What shipping methods are available?
A: We support sea freight, air freight, express delivery, and postal services based on order requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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