Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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ABS ESD Waffle Pack Chip Trays 101.57×101.57×3mm for IC Components with 120 Cavity Matrix

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview
Our Waffle Pack Chip Trays provide reliable electronic component handling with consistent cavity alignment and secure protection from contamination. These anti-static trays are specifically designed to prevent contact with sensitive areas of electronic components.
Anti-static tray storage effectively prevents short-circuit phenomena by eliminating static electricity buildup during placement and transportation, ensuring product quality and preventing circuit board damage.
Technical Specifications
Parameter Specification
Brand Hiner-pack
Model HN230*300-18
Outline Size 101.57×101.57×3mm
Cavity Size 5.84×7.62×0.46mm
Matrix Quantity 10×12=120PCS
Material ABS
Flatness MAX 0.3mm
Resistance 1.0×10⁴-1.0×10¹¹Ω
Package Type IC Parts
Color Black
Certificate RoHS
Key Advantages
  • Flexible OEM Service: Custom production based on customer samples or designs
  • Multiple Material Options: ABS, PC, MPPO, PPE, PEI, IDP, and more
  • Advanced Manufacturing: Tooling making, injection molding, and production capabilities
  • Comprehensive Customer Support: From consultation to after-sales service
  • 12 Years OEM Experience: Specialized in USA and EU markets
  • In-House Factory: High-quality control with fast, flexible production
Applications
Semiconductor wafer die, wafer bare, electronic components, optical electronic components, and related electronic manufacturing applications.
Customization Options
Feature Customization
Size Can be customized
Material ABS / PC / MPPO / PPE / etc.
OEM & ODM Available
Color Can be customized
Features Durable, Reusable, Eco-friendly, Biodegradable
Minimum Order Quantity 500pcs
Delivery Time 8-10 working days (depending on quantity)
Product Images
Waffle pack IC chip tray HN230*300-18 showing cavity design and anti-static properties Close-up view of waffle pack IC chip tray with precise cavity alignment

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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