Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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Traditional Black 2 Inch Waffle Pack Chip Trays - 50.7x50.7x4mm ABS ESD Protection for Electronic Components

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Traditional Black 2 Inch Waffle Pack Chip Trays provide precision-molded cavities designed to match your chip's footprint, eliminating rattling, shifting, and handling issues during electronic component packaging.

Waffle Pack Design Features

Waffle packs are embossed pocketed trays, typically made of plastic, that resemble breakfast waffles. These trays are specifically designed for very small or unusually shaped parts and are loaded using pick and place equipment.

Anti-Static Protection

Our anti-static trays effectively release static charge accumulated on component surfaces, preventing charge buildup and high potential differences. This significantly reduces electronic product damage during production, lowers costs, and improves product quality and profitability.

Applications
  • Semiconductor Wafer Die Wafer Bare
  • Electronic components
  • Optical electronic components
Technical Specifications
Parameter Specification
Brand Hiner-pack
Model HN18101
Outline Line Size 50.7×50.7×4mm
Cavity Size 2.84×1.84×0.6mm
Matrix Quantity 12×16=192 PCS
Material ABS
Color Black
Resistance 1.0×10⁴-1.0×10¹¹Ω
Flatness MAX 0.2mm
Certificate RoHS
Product Features
Category Details
Usage Packaging of Electronic Components, Optical device
Features ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Available Materials MPPO, PPE, ABS, PEI, IDP...etc.
Available Colors Black, Red, Yellow, Green, White, and custom colors
Size Options Customized sizes, rectangle, circle shape
Mold Type Injection Mold
Design Services Original sample creation or custom designs
Lead Time 5-7 Working days (varies by quantity)
Product Images
Traditional Black 2 Inch Waffle Pack IC Chip Tray HN18101 showing precision-molded cavities Close-up view of Waffle Pack IC Chip Tray HN18101 with electronic components
Frequently Asked Questions
Q1: Are You a Manufacturer or a Trade Company?
We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What is the material of your product?
ABS, PC, PPE, MPPO, PEI, HIPS...etc.
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirements.
Q4: How can I get the quotation for the custom products?
Let us know the size of your IC or component thickness, and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send them right now if you are interested in something we have in stock, and customize the project depending on the specific time.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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