Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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Antistatic Waffle Pack Chip Trays 2-4 Inch IC Packaging with 1.0×10⁴-1.0×10¹¹Ω Surface Resistance

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Antistatic Waffle Pack Chip Trays

Professional IC packaging solutions for protecting CSP (Chip Scale Packaging) and bare dies during transportation and handling.

Product Overview

Anti-static chip trays with digital array design are specially engineered for cavity protection of electronic components. These trays effectively prevent short circuits by eliminating static electricity buildup during placement and transportation processes.

Manufacturer Advantages
  • 10+ years experience in ESD tray manufacturing
  • Adequate supply capacity for consistent product availability
  • Professional non-standard customization services
  • Multiple material options: MPPO, PPE, ABS, PEI, IDP, and more
  • Compliance with JEDEC antistatic standards
  • Permanent unitary antistatic properties
Technical Specifications
Outline Size Material Surface Resistance Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.3mm Customizable
Custom sizes ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω TBC Customizable
Standard Model Specifications
Outline Line Size 50×50×5mm
Model HN21038
Cavity Size 7.5×6×1.2mm
Matrix Quantity 5×5=25 pieces
Material ABS
Flatness MAX 0.2mm
Color Black
Surface Resistance 1.0×10⁴-1.0×10¹¹Ω
Certificate ROHS
Applications
  • Wafer die, bar, and chip handling
  • PCBA module component protection
  • Electronic component packaging
  • Optical device packaging
Packaging & Customization

Custom packaging solutions available according to customer specifications and requirements.

Antistatic waffle pack chip tray with multiple cavities for IC component protection
Frequently Asked Questions
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
Q: How long is your delivery time?
A: Typically 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we offer samples which may be free or charged based on product value, with shipping costs typically collected or as agreed.
Q: What kind of Incoterm can you support?
A: We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other incoterms as agreed.
Q: What shipping methods do you offer?
A: By sea, by air, or by express/mail post according to customer order quantity and volume.
Close-up view of antistatic chip tray cavities showing precise dimensions Multiple antistatic waffle pack trays stacked for storage and transportation

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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