Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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Black MPPO ESD Component Tray 7.62mm Thick for BGA IC Devices - 322.6x135.9mm JEDEC Standard

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview
Secure, stackable, and fully traceable, our JEDEC trays streamline logistics in fast-paced manufacturing environments. These standard-defined trays are designed for transporting, handling, and storing complete chips and other components.
Standard Specifications
All JEDEC trays feature consistent outline dimensions of 322.6mm x 135.9mm x 7.62mm, ensuring compatibility across manufacturing processes.
Technical Parameters
ParameterSpecification
BrandHiner-pack
ModelHN1890
Package TypeBGA IC
MaterialMPPO
ColorBlack
Outline Dimensions322.6mm × 135.9mm × 7.62mm
Cavity Size6mm × 8mm × 1mm
Matrix Quantity24 × 16 = 384 PCS
FlatnessMAX 0.76mm
Surface Resistance1.0×10⁴ - 1.0×10¹¹ Ω
CertificationRoHS Compliant
ServicesAccept OEM, ODM
Material Temperature Resistance
MaterialBake TemperatureSurface Resistance
PPE125°C - Max 150°C1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Fiber125°C - Max 150°C1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Powder125°C - Max 150°C1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Glass Fiber125°C - Max 150°C1.0×10⁴ - 1.0×10¹¹ Ω
PEI + Carbon FiberMax 180°C1.0×10⁴ - 1.0×10¹¹ Ω
IDP Color85°C1.0×10⁶ - 1.0×10¹⁰ Ω
Color, temperature, and other special requirements can be customized to meet specific application needs.
Custom Packaging Solutions
We provide comprehensive packaging IC design solutions tailored to your chip requirements. Our custom trays not only store ICs effectively but also provide superior chip protection. We support various packaging methods including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP.
Company Advantages
  • 12+ years of export experience
  • Professional engineering team and efficient management
  • Short delivery time with normally stocked items
  • Small quantity orders accepted
  • 24-hour response professional sales services
  • Global export reach including USA, Germany, UK, Europe, Korea, Japan
  • ISO certified factory with RoHS compliant products
Applications
Electronic components, Semiconductors, Embedded Systems, Display technology, Micro and Nano systems, Sensors, Test and Measurement Technology, Electromechanical equipment and systems, Power supply applications.
Product Images
JEDEC tray IC chip tray HN1890 model showing component storage design JEDEC tray IC chip tray HN1890 detailed view showing cavity layout and dimensions
Frequently Asked Questions
Q1: Are you a manufacturer?
Yes, we have an ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Normally, 3 days. If customized, open a new mold 25-30 days around.
Q4: How about batch order production?
Normally, 5-8 days or so.
Q5: Do you inspect the finished products?
Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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