BGA Chip JEDEC Trays 198PCS Custom Design with 322.6mm × 135.9mm Dimensions and 150°C Heat Resistance
Price:
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
MOQ:
1000 pcs
Delivery Time:
5~8 working days
Brand:
Hiner-pack
Product Description
Product Overview
Custom JEDEC trays designed for BGA chips and various IC packaging types, featuring heat-resistant MPPO materials and standard 322.6mm × 135.9mm dimensions. These trays provide optimal protection during transport, handling, and storage of semiconductor components.
Key Features
• 198-cavity matrix configuration (22×9)
• Heat-resistant materials withstand temperatures up to 150°C
• Compatible with BGA, FBGA, LGA, QFN, QFP, PGA, TQFP, LQFP, SoC, and SiP packaging
• Standard JEDEC outline dimensions: 322.6mm × 135.9mm × 7.62mm
• Surface resistance range: 1.0×10⁴Ω to 1.0×10¹¹Ω
• RoHS certified for environmental compliance
Technical Specifications
| Parameter | Specification |
|---|---|
| Brand | Hiner-pack |
| Model | HN2074 |
| Outline Dimensions | 322.6mm × 135.9mm × 7.62mm |
| Cavity Size | 10.8mm × 5.3mm × 1.1mm |
| Matrix Quantity | 22×9 = 198 PCS |
| Material Options | PPE, MPPO, ABS, PEI, IDP |
| Flatness | MAX 0.76mm |
| Color | Black (custom colors available) |
| Surface Resistance | 1.0×10⁴Ω to 1.0×10¹¹Ω |
| Certification | RoHS |
Material Performance
| Material | Bake Temperature | Surface Resistance |
|---|---|---|
| PPE | 125°C~Max 150°C | 1.0×10⁴Ω~1.0×10¹¹Ω |
| MPPO + Carbon Fiber | 125°C~Max 150°C | 1.0×10⁴Ω~1.0×10¹¹Ω |
| MPPO + Carbon Powder | 125°C~Max 150°C | 1.0×10⁴Ω~1.0×10¹¹Ω |
| MPPO + Glass Fiber | 125°C~Max 150°C | 1.0×10⁴Ω~1.0×10¹¹Ω |
| PEI + Carbon Fiber | Max 180°C | 1.0×10⁴Ω~1.0×10¹¹Ω |
| IDP Color | 85°C | 1.0×10⁶Ω~1.0×10¹⁰Ω |
Custom color, temperature, and other special requirements available upon request.
Applications
Electronic components, semiconductors, embedded systems, display technology, micro and nano systems, sensors, test and measurement technology, electromechanical equipment and systems, power supply applications.
Service Advantages
• Flexible OEM/ODM services with custom design capabilities
• Multiple material options including MPPO, PPE, ABS, PEI, IDP
• Comprehensive manufacturing process: tooling, injection molding, production
• 12 years of OEM experience for USA and EU customers
• In-house factory ensuring high quality control and flexible production
• Full-service support from consultation to after-sales
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu