Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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ESD 4-Inch Black Waffle Tray Packaging Lids - High Temperature Resistant IC Chip Covers with 5-7 Day Lead Time

Price Negotiable
Price: $0.28~0.55
MOQ: 1000
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
ESD 4-Inch Black Waffle Tray Packaging Lids

High temperature resistant covers designed for IC chip tray protection with superior ESD properties and durability.

Product Overview

These 4-inch black waffle tray packaging lids provide exceptional protection for sensitive electronic components during handling, storage, and transportation. Manufactured with high-temperature resistant materials and ESD-safe properties.

Key Advantages
  • Suitable for daily turnover and long-distance freight applications
  • High stacking capacity with multiple layers
  • High-temperature washable for repeated use
  • Plastic construction provides waterproof and moisture-proof protection
  • Prevents component extrusion and breakage with superior protection
  • Reusable design ensures quality assurance and cost efficiency
Applications

Wafer dicing, wafer sorting, wafer/die pick and place operations, and wafer/die shipping applications.

Technical Specifications
Parameter Specification
Usage Packaging of Electronic Components, Optical Devices
Features ESD Protection, Durable, High Temperature Resistance, Waterproof, Recyclable, Eco-friendly
Material PC, ABS, and other engineering plastics
Color Options Black, Red, Yellow, Green, White and Custom Colors
Size Customized dimensions, rectangle and circle shapes available
Mold Type Injection Mold
Design Original samples or custom designs
Standard Size 4-inch diameter
Lead Time 5-7 working days (varies by order quantity)
Manufacturing & Quality

All products are manufactured according to ISO 9001 standards with comprehensive quality control inspections by dedicated QC staff.

Frequently Asked Questions
Q: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specializing in packaging solutions for over 12 years with a 1500 square meter workshop located in Shenzhen, China.
Q: What information is needed for quotation?
A: Please provide component drawings, required quantity, and size specifications.
Q: How long for sample preparation?
A: Standard samples: 3 days. Custom trays with new molds: 25-30 days.
Q: Production time for batch orders?
A: Typically 5-7 working days, depending on order quantity.
Q: Do you perform quality inspections?
A: Yes, all products undergo rigorous inspection according to ISO 9001 standards by our quality control team.
ESD 4-inch black waffle tray packaging lid for IC chip protection Close-up view of waffle pack IC chip tray lid showing protective design

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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