Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu

ESD Black Waffle Pack IC Chip Tray 50.7x50.7x4mm for Micro Die with 440 Cavities and 10⁴-10¹¹Ω Resistance

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
ESD Black Waffle Pack IC Chip Tray for Micro Die
Anti-static IC chip trays effectively dissipate static charge accumulation, preventing high potential differences that can damage sensitive electronic components during production, transportation, and packaging processes.
Product Specifications
Parameter Value
Outline Size 50.7 × 50.7 × 4 mm
Model HN21063
Cavity Size 1.2 × 0.9 × 0.8 mm
Matrix Quantity 20 × 22 = 440 PCS
Material ABS
Color Black
Surface Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Flatness Max 0.2 mm
Certification ROHS, SGS
Available Sizes & Materials
Outline Size Material Options Surface Resistance Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.2 mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.25 mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.3 mm Customizable
Custom Size ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω TBC Customizable
Industry Applications
  • Semiconductor manufacturing
  • Electronic component production
  • SMT surface mounting facilities
  • Optical industry applications
  • Military industry components
Manufacturing Advantages
  • 10+ years export experience
  • Professional engineering and efficient management
  • Short delivery times with regular stock availability
  • Small quantity orders accepted
  • 24-hour responsive customer service
  • Global export to USA, Germany, UK, Europe, Korea, Japan
  • ISO certified factory with ROHS compliance
Customization Services
We provide professional design and packaging solutions tailored to your specific requirements, including OEM and ODM services with logo customization.
ESD Black Waffle Pack IC Chip Tray for micro die components Close-up view of ESD chip tray cavities for micro die protection ESD tray packaging solution for electronic component manufacturing

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.