OEM Electronic PCB Assembly Services FR4 CEM1 CEM3 SMT PCBA

OEM Electronic PCB Assembly Services FR4 CEM1 CEM3 SMT PCBA

Shenzhen OEM Electronic PCBA Board Manufacturer PCBA Prototyping Custom Service

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

4. What data are needed for PCB & PCBA production?
4.1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name, and part number.
4.2 PCB Gerber files.
4.3 PCB fabrication drawing and PCBA assembly drawing.
4.4 Test procedures.
4.5 Any mechanical restrictions such as assembly height requirements.

PCBA Capability

1. How does Leadsintec ensure quality? Our high-quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipment and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector), and ICT(in-circuit testing).
1.4.Dedicated quality assurance team with failure case analysis process
1.5.Continuous staff training and education

2. How does Leadsintec keep your price competitive?

Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled, or quadrupled; Chinese currency RMB had appreciated 31% over the US dollar, And our labor cost also increased significantly.
However, Leadsintec has kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes, and improving efficiency. Our prices are very competitive in the industry at the same quality level.
We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edge on cost and quality.

5. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-band→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

6. What’s the key equipment for HDI manufacturing?

The key equipment list is as follows: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc. The equipment we have are the best in the industry, laser drilling machines are from Mitsubishi and Hitachi, LDI machines are from Screen(Japan), Automatic Exposing machines are also from Hitachi, all of them make we can meet customer’s technical requirements.

7. How many types of surface finish O-lead can do?

Leadsintec has the full series of surface finish, such as ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

8. What’s your capability for FPC? Can Leadsintec provide SMT service also?

Leadsintec can fabricate FPC from a single layer to 8layer, the working panel size can be as large as 2000mm*240mm, please find the details on the page “Flex Capability”. We also provide SMT one-stop service to customers.

9. What are the main factors that will affect the price of PCB?

Material;
Surface finish;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
Different manufacturing countries.

10. What’s the definition of PCB, PWB, and FPC, and what’s the difference?

PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, the same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.

11. What factors should be considered when choosing the material for a PCB board?

Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operating temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high-frequency PCB;
Polyimide glass fiber substrate used for flexible PCB; Metalcore is used when the product has a strict requirement of heat
dissipation.

12. What are the merits of Leadsintec's rIgid-flex PCB?

Leadsintec’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

13. How do you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft, and the CITS 500s equipment from POLAR INSTRUMENTS. The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.

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