Wire Diamond Powder HID WD Industrial Diamond For Diamond Wire
super hard WD Wire Diamond Powder 6-12um to 8-16um
Description:
Industrial diamond micron powder is a new type of super-hard abrasive, which is mainly used to manufacture tools used in the process of processing high-hardness and high-precision objects in industrial production.
At present, W0-0.5 to W6-12 are generally used for polishing; W15-10 to W22-36 are used for grinding; W12-22 is coarser for fine grinding.
It has the following important features:
- Strictly control the size classification
- Uniform particle shape characteristics
- Control raw materials
Our company's synthetic diamond powder is divided into three categories:
- Refined diamond powder is mostly used for the fine grinding, grinding and polishing of hard alloys, non-metals (for example: gemstones, ceramics, optical glass) and other high-hardness materials.
- High-purity diamond powder is made of high-strength diamond, and the impurity content is less than 250pbm. It is used to process high-precision parts, instruments and machinery required by aerospace, aviation, electronics, petroleum, geology, military industry and other industrial sectors. For example: PCD composite chip, chip, etc.
- Export diamond micropowder for stone tools. The professionally produced high-quality diamond micropowder is an ideal consumable for various high-end stone tools.
It is made of high grade and high strength diamond as raw material, on the basis of conventional diamond powder technology, by carrying out special treatment for the crystal shape and surface purification, particles have features of very clean surface, high toughness, consistent crystal shape, good thermal stability and wear resistance. Through our unique technology of critical oversize elimination and length/width ratio control, the particles also have strictly concentrated PSD, and very high content of effective grinding grits. Besides, a variety of coated products are available, it greatly enhances the retention between diamond particles and the bond, thus to prolong the tool's life and improve the sharpness. It also facilitates heat dissipation within the bond system resulting in longer service life of products.
Size Available for Grade HID-WD (μm)
| 4-6 | 4-8 | 5-10 | 6-12 | 8-12 |
| 8-16 | 10-15 | 10-20 | 12-22 | 15-25 |
| 20-30 | 22-36 | 30-40 | 40-50 | 50-60 |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Sharp and blocky crystal shape
Very clean and purified diamond surface (below 20PPM)
Concentrated PSD
High content of effective grinding grits
Characteristics:
With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.
Application for Wire Diamond Micron Powder Grade HID WD:
It is designed for producing diamond wire, and it is also widely used for cutting, grinding and polishing hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, sapphire, quartz, semiconductor, liquid crystal glass, magnetic materials, etc.
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