Industrial Resin Bonded Diamond Grade BRD30 For Grinding Wheel

60/80-325/400 Resin Bond Industrial Diamond for Grinding Wheel

Description:

Single crystal diamond is produced by HPHT (high-pressure, high-temperature) synthesis. The diamond particles feature an oriented crystal structure with parallel-running cleavage planes, similar to natural diamond. For diamond tools, particle fracturing provides a self-sharpening mechanism and thus increases tool life. Single crystal diamond is a popular choice for precision grinding, lapping and polishing of various materials.

BRD series are polycrystalline-like diamond graine, mainly used in resin bond diamond grinding wheels. Harmony Industry Diamond (H.I.D.) boron doped technology largely improve BRD series bond strengh accordingly, elevate bond retention capabilities to crystal. Polycrystalline-like diamond graine is composed of sub-crystals with mosaic structure that provides the graine with irregular shape and rough surface. Polycrystalline-like diamond can keep consistency of self-sharpening and sharp cutting edges.

Available Size of Resin Bond Mesh Diamond Powder:

Abrasive Materials Mesh Size Comparison List

Feature:

Light green color, blocky, the most tough product among BRD series. Widely used for heavy duty application demanding long wheel life.

Consistent frianility prevents workpiece from scratch or burn, largely decrease defective rate.
High Efficiency
Perfect surface
Longer life

Characteristics:

Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.

Application for Resin Bond Diamond Powder:

Precision lapping and polishing of SiC and Al2O3 wafers;
Grinding and polishing of ceramic materials;
Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.

Ti-TTi Comparision of BRD Mesh Series:

Shape Comparision of BRD Mesh Series: