Henan Harmony Industry Diamond Co., Ltd.
                                                                                                           
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Chemicals Polymer

100% Cu Coated 325/400 For Resin Bond Diamond Powder Grade HID R

Price Negotiable
Price: Negotiable
MOQ: 1,000 Carat
Delivery Time: 3-5 days
Brand: Harmony
Product Description

325/400 mesh Plated Resin Bond Diamond Powder for Lapping

 

Description:

Plated diamond particle products are mainly divided into electro-plated diamond particles and chemical-plated diamond particles. One layer of metal is plated on the surface of diamond particles for improving holding force, reducing thermal shock, protecting the diamond surface from oxidation and graphitization so as to prolong service life of tools. Plated metals are nickel(Ni), titanium(Ti) and copper(Cu).
Plated diamond particles also can be divided into the fallowing two types according to exterior appearance of the plated diamond particles:
Normal type: plated diamond has a smooth plating surface.
Dendritic crystal-burr type: metal coated on the surface of diamond particle forms a structure of dendritic crystal,it looks like a burr,and most burrs are concentrated on the edge.The crystallization of the coated layer on the surface of diamond particle is fine.

 

Available Sizes:

Micron
4-6 4-8 5-10 6-12 8-12 8-16
10-15 10-20 12-22 15-25 20-30 22-36
20-40 30-40 35-45 40-50 45-50 50-60
Mesh
50/60 60/70 70/80 80/100 100/120 120/140
140/170 170/200 200/230 230/270 270/325 325/400

 

Particle Size Distribution Specification for Superabrasive Grains

Size D10≥(µm) D50(µm) D95≤(µm) Max(µm) Min(µm)
0-0.25 0.1 0.170~0.210 0.38 -- --
0-0.5 0.12 0.220~0.280 0.51 --- --
0-1 0.42 0.501~0.580 0.795 1.156 0.375
0.5-1 0.472 0.581~0.690 1.053 1.375 0.375
0.5-1.5 0.504 0.691~0.871 1.298 1.945 0.375
0-2 0.62 0.872~0.985 1.542 2.312 0.446
1/2 0.761 0.986~1.224 1.894 3.27 0.63
0.5-3 0.94 1.225~1.487 2.401 3.889 0.63
1/3 1.048 1.488~1.712 2.882 4.625 0.75
1.5-3 1.169 1.713~2.014 3.321 5.5 0.75
2/3 1.392 2.015~2.302 3.663 6.541 0.892
2/4 1.644 2.303~2.754 4.496 7.778 0.892
2/5 1.803 2.755~3.312 5.5 9.25 1.06
3/6 2.448 3.313~3.898 6.386 11 1.499
3/7 2.913 3.899~4.676 7.566 13.08 1.783
4/8 3.605 4.677~5.400 8.455 15.56 2.121
4/9 3.952 5.401~6.062 9.762 18.5 2.522
5/10 4.401 6.063~6.700 10.98 18.5 2.999
5/12 5.022 6.701~7.673 12.95 22 3.566
6/12 5.807 7.674~8.549 13.97 26.16 4.241
7/14 6.411 8.550~9.483 15.13 26.16 4.241
8/16 7.113 9.484~10.78 17.82 31.11 5.044
8/20 8.102 10.79~12.56 20.6 37 5.998
10/20 9.186 12.57~14.18 22.54 37 7.133
12/22 10.53 14.19~16.05 24.41 44 7.133
12/25 12.01 16.06~17.65 26.61 44 8.482
15-25 13.32 17.66~19.55 29.75 52.33 10.09
20-30 15.04 19.56~22.50 34.64 62.23 12
22-36 17.28 22.51~26.12 39.98 74 12
30-40 20.11 26.13~30.10 46.56 88 14.27
30-50 22.36 30.11~34.58 52.87 88 16.96
36-54 25.68 34.59~39.00 60.94 104.7 20.17
40-60 29.45 39.01~43.20 69.86 124.5 20.17
50-70 32.42 43.21~47.50 72.65 124.5 23.99
54-80 36.56 47.51~52.50 80.74 124.5 23.99

 

Abrasive Materials Mesh Size Comparison List

HARMONY 国际标准 欧洲共同体 美国 U.S.A 日本 JAPAN 理论基准尺寸 俄罗斯 RUSSIA
GB/T6406-1995 ISO FEPA ANIS B74.16-1971 JIS4130-1988 Theoretlcal 9206-80
Baslc Size
Grain No Grain Size Grain No Ⅰ Grain No Ⅱ Grain Size Grain No Grain Size Grain No Grain Size Grain No Grain Size Inch Mlllmeter Grain No Grain Size
40/50 425/300 427 40/50 425/300 B/427 355/300 40/50 425/300 40/50 425/300 0.015 0.378 500/400 500/400
50/60 300/250 301 50/60 300/250 B/301 300/250 50/60 300/250 50/60 300/250 0.011 0.288 400/315 400/315
60/80 250/180 252 60/80 250/180 B/252 250/180 60/80 250/180 60/80 250/180 0.009 0.226 250/200 250/200
80/100 180/150 181 80/100 180/150 B/181 180/150 80/100 180/150 80/100 180/150 0.0069 0.174 200/160 200/160
100/120 150/125 151 100/120 150/125 B/151 150/125 100/120 150/125 100/120 150/125 0.0058 0.148 160/125 160/125
120/140 125/106 126 120/140 125/106 B/126 125/106 120/140 125/106 120/140 125/106 0.0048 0.123 125/100 125/100
140/170 106/90 107 140/170 106/90 B/107 106/90 140/170 106/90 140/170 106/90 0.0041 0.103 100/80 100/80
170/200 90/75 91 170/200 90/75 B/91 90/75 170/200 90/75 170/200 90/75 0.0034 0.086 80/63 80/63
200/230 75/63 76 200/230 75/63 B/76 75/63 200/230 75/63 200/230 75/63 0.003 0.075 63/50 63/50
230/270 63/53 64 230/270 63/53 B/64 63/53 230/270 63/53 230/270 63/53 0.0026 0.066 50/40 50/40
270/325 53/45 54 270/325 53/45 B/54 53/45 270/325 53/45 270/325 53/45 0.0022 0.057 -  - 
325/400 45/38 46 325/400 45/38 B/46 45/38 325/400 45/38 325/400 45/38 0.0019 0.048 -  - 

 

Feature:
Nickel – 30%,56% or 60% by weight, or any customized specification
Copper – 50% by weight or any customized specification
Used to enhance bond retention
Allows for better heat dissipation
Can be Customized based on customers' demand

 

Characteristic:
Bonding strength between diamond/CBN and binding agent increased, also grit's holding strength.
The coated layer can separate air, increase heat dissipation, reduce thermal damage to diamond/CBN.
It can blanket particle defects and uplift their strength.

 

Coated Diamond Series:
Grade HID Ni Coated Diamond
Description: Coated diamond is divided into electrolytic and chemical plating, it includes Ni coating, Cu coating, Ti coating, Cr coating etc. Coated diamond effectively increase holding force between diamond and bonding, reduce thermal shock, protect diamond against oxidation and graphite, lengthen product lifetime.

Application: Electroplating Nickel products mainly used in resin bond products with dry and wet abrasives, effectively improve the holding force with good thermal stable ability, avoid carbonization in high speed cutting. Chemistry plating Nickel products mainly used in resin bond products with dry and wet abrasives, no external current conditions, and deposited metal on diamond surface by process of self-catalytic redox reactions, form the thickness and density of nickel-plated.

 

Grade HID Cu Coated Diamond
Description: Recommend for resin bond tools. Able to effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.

Characteristics:
Effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.


 

Grade HID Ti Coated Diamond

The coating greatly enhances the mechanical attachment of diamond to the bond matrix through the strong metallurgical adhesion between Ti and the matrix. It also protects diamond from oxidation or metal erosion which causes graphitization of the diamond, therefore, improves the application features of diamond tools.


 

Grade HID Si Coated Diamond
Silicon coating strengthens the retention between bond and diamond, improves the thermal stability, wear resistance and helps better conduct the heat. It also helps to avoid the corrosion from Fe, thus it protects the diamond, prolongs the tools' life and raises the sintering temperature.

 

Grade HID W Coated Diamond
W reacts with diamond particles and generates WC, which is with good thermal stability and wear resistance. The coating improves the bond retention and enhances the diamond toughness, its alloy coating layer improves the thermal conductivity, which can prolong tool life.

 

Grade HID Co Coated Diamond
Cobalt coating could improve the retention of diamond and bond. In addition, the sintering temperature could be raised because the coating can protect diamond from oxidation and corrosion. It also enhences the hardness and abrasive resistence of coated diamond.

 

Grade HID Cr Coated Diamond
Chromium enjoys nice wettability and affinity on diamond. It forms a layer of chromium-carbide between diamond and bond during coating and sintering, thus the coating improves the retention between diamond and bond. It also increases the hardness and abrasive resistance of coated diamond.

 

Application Field:
- Nickel electroplated products: the product is mainly used to fabricate resin-bonded tools for dry and wet grinding processing of materials. The product has good heat dissipation feature, which can prevent carbonization of diamond particles in high-speed cutting. Nickel-plated diamond with burrs easily combines with resin, thereby achieving better holding force. Service life of tool produced by nickel-plated diamond particles is longer than that of normal type diamond particles.
- Chemical nickel-plated diamond particles: the product is mainly used to fabricate resin-bonded tools for dry and wet grinding processing of materials. In the process of chemical plating,current is not necessary, metal coated layer on the surface of diamond particle is carried out by self-catalytic redox reaction, so the metal layer formed shows features with uniform thickness and dense structure.
- Electro-plated diamond particles with different weight ratio and chemical-plated diamond particles with size in the range of 5-60um are available upon requests; or sizes can be tailored as per customser's requirments.- Copper coated diamond abrasive is mainly used to manufacture resin bonded dry grinding wheels.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Henan Harmony Industry Diamond Co., Ltd.
Location No. 1394 Hanghai East Road, E & T Development Zone, Zhengzhou 450016 China
Contact Person Sara Lau

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