Metal Bonded Monocrystalline Micron Diamond Powder Grade HID A
HID A Metal Bond Monocrystalline diamond powder 0.05um-60um
Description:
Monocrystalline diamond powder is relatively inexpensive to produce and therefore widely used for grinding, lapping and polishing applications.
Industrial diamonds are used for the cutting and grinding of very hard materials, for optical devices, such as lasers, for heat dissipation, and for diamond coatings to produce enhanced wear resistance.
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Monocrystalline Micron Diamond Powder Series:
- Premium Grade Micron Diamond HID A+
Description: Raw material is adopted from high technology MBD series of high quality diamond, more regular crystal shape with patented technology process, nearly spherical particle shape, more concentrated particle size distribution and low impurity content, very clean particle surface, easy to disperse to various types of vector and combined with various binders solidly.
Application: Suitable for precision grinding of optical glass, optical grinding pills films, optical grinding wheels, precision polishing wafers, precision grinding wheels of silicon materials for sapphire processing, precision machining tools for jade gem processing.
- Standard Grade Micron Diamond HID A
Description: Raw material is adopted from SCD series of high quality diamond, adopts the advanced production technology, combined with the unique particle shaping technology, produced base on international requirements standardization. With regular crystal shape and low impurity content, particle size distribution is in line with national standards.
Application: Traditional sawing, cutting, grinding, grinding, polishing, as well as a specific range of high-precision cutting, grinding, and polishing, can be used as raw materials for various types of diamond tools and diamond paste and slurry.
- Standard Grade Micron Diamond HID B
Description: Using medium strength diamond as raw material, the crystal shape of the product is regular, the impurity content is low, the grinding efficiency is high, and the particle size distribution meets the national standard.
Application: Suitable for ceramic bond abrasives, resin bond abrasives, all kinds of plating tools, grinding paste, grinding fluid.
- Economic Grade Micron Diamond HID G
Description: Raw material is adopted from RVD series of ordinary diamond, adopt the advanced production technology, produce base on international requirements standardization. With the irregular crystal shape, impurity content and particle size distribution is in line with national standards.
Application: Suitable for resin bond abrasive tools, all kinds of electroplating tools, grinding paste and slurry.
Characteristics:
With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.
Application for Harmony Micron Diamond Powder:
- Traditional gem polishing: single crystal powder or abrasive paste of about 3um is traditionally used
- Raw material for sintering PCD: Micron-sized powder is expanding with the application of PCD tools.
- Grinding and polishing of sapphire wafers: micron to sub-micron, polycrystalline/single crystal polishing liquid is developing rapidly with LED.
- Grinding and polishing of optical fiber connectors: micron to sub-micron, polishing film.
- Ceramic processing: single crystal or polycrystalline powder can be used. For example, fiber ceramic ferrule: single crystal powder from micron to sub-micron, application products include grinding wheel, grinding fluid, polishing film. The application prospects in this area are good.
- Magnetic head: such as grinding and polishing of GMR magnetic head, submicron ~ nanometer, polishing liquid/polishing film.
- Grinding and polishing of super-hard metal rollers or devices: micron to sub-micron, polishing film/abrasive paste/grinding wheel develops steadily.
- Polishing of metal molds: micron to sub-micron, diamond polishing liquid/grinding paste is developing steadily.
- Raw materials for various grinding tools: single crystals of various grain sizes, there is still broad room for development!
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