Ultra Detonated Polycrystalline Micron Diamond Powder Grade HID PD
HID PD Ultra Detonated Polycrystalline Diamond Powder for polishing
Description:
Industrial synthetic diamond powder is a new type of super-hard abrasive, which is mainly used for manufacturing tools used in the process of processing high-hardness and high-precision articles in industrial production.
Currently, it is generally used for polishing from w0-0.5 to w6-12. W15-10 to w22-36 for grinding; W12-22 coarse for fine grinding.
It has the following important features:
- Strictly control the size classification
- Uniform particle shape characteristics
- Control raw materials
Polycrystalline Diamond (HID PD) is a new type of high-technology materials in 21st century,which is a polymer of nano diamond produced by means of detonation at transient state with ultra higher pressure and temperature and resemble"carbonado" in the rare natural meteoric stones.
HID PD is a polycrystal consisting of cubic diamond and hexahedron diamond.It has higher toughness and higher hardness as well,as a new type of abrasive it is unchallenged and irreplaceable in the lapping and polishing of sapphire substrate.
Polycrystalline micron diamond powders are consisted of nano-crystallites that give it a unique break down mechanism which allows new cutting edges to be exposed creating self-sharpening characteristics. Because of its polycrystalline nature, HID PD has no defined cleavage planes. It can therefore tolerate 3 times higher operating pressure than monocrystalline diamond. Another major advantage of HID PD is the diamond particles have a specific surface with much more contact points and cutting edges,and producing the most scratch free surface possible and superior finish as well.
Available Sizes of Polycrystalline Diamond Powder:
| Range | 0-1 | 1-2 | 1-3 | 2-4 | 2-5 | 3-6 | 3-7 | 4-8 | 5-10 | 6-12 | 8-12 |
| HID PD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate
Characteristics:
Round particle shape, no irregular shapes like pencils or flakes.
Oversizes completely removed.
Narrow PSD.
Surface purity can reach ppm level.
Outstanding dispersibility.
Application for Polycrystalline Diamond Powder HID PD:
Polycrystalline diamond is primarily for high-performance grinding and polishing process. It can be widely used for grinding and polishing of silicon wafer, ruby, sapphire, optical lens, metallographic sample, optical fiber communication and ceramics in IT industry, as well as disc modification, magnetic head polishing and substrate grinding.
Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers
Surface polishing of various ceramics
Surface treatment of metals, such as stainless steel and aluminium alloy.
Workpieces Processing
- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers
- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film
- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror
- Precision cemented carbide, precision ceramics, optical glass and lens, etc.
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