Polycrystalline Like Micron Diamond Powder Grade HID PLD For Lapping
High Precision 2-4 to 36-54 Micron Diamond Powder For Lapping Ceramic
Description:
A special surface treatment process is adopted to cause a chemical reaction on the surface of the original particles, increase the surface roughness of the diamond particles, and enhance the holding force between the diamond particles and the bonding agent. Improve the self-sharpening and cutting force of the original diamond. And in the cutting and polishing process, it can effectively avoid scratches on the surface of the processed workpiece and improve the polishing accuracy. Mainly recommended for sapphire, SiC, silicon wafer polishing and finishing polishing.
Available Size of Polycrystalline Like Diamond Powder:
| Size | 2-4 | 3-6 | 4-8 | 5-10 | 6-12 | 8-16 | 10-20 | 15-25 | 20-30 | 22-36 | 30-40 | 36-54 |
| HID PLD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
- Strong cutting force: The particle surface has a large number of sharp cutting edges, and the cutting force can reach 2-4 times that of single crystal diamond powder;
- High polishing accuracy: The cutting edge of single crystal diamond powder particles is large and hard, which is prone to deep scratches. The cutting edge of polycrystalline diamond powder particles is small and the hardness is low. After polishing, the surface Ra value of the workpiece is significantly reduced;
- Strong holding power: The surface of the particles is rough, and the bond is more firmly bonded, which can significantly improve the holding power of abrasives in various diamond products and increase the service life.
Characteristics:
Concentrated particle size distribution
High self-sharpening ability
High grinding efficiency
Uniform crystal size
Long working Life
Cost-effective
High purity
Application for Polycrystalline Like Diamond Powder HID PLD:
- Precision grinding and polishing of SiC, Al2O3 and other wafers;
- Grinding and polishing of ceramic materials;
- Precision grinding and polishing of stainless steel, aluminum alloy and other metal materials
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