0-2um Grade HID PD Detonated Polycrystalline Diamond Micropowder
0-2um Detonation Polycrystalline Diamond Powder For Semiconductor Wafer
Description:
Polycrystalline diamond micropowder is made of graphite using a unique directional blasting method. The shock wave of the directional blasting of high-speed explosives accelerates the flight of metal flying pieces and hits the graphite pieces to cause the graphite to be converted into polycrystalline diamond. Its structure is very similar to natural diamond, which is formed by the combination of unsaturated bonds and has good toughness.
The structure is very similar to natural Carbonado, which is made up of spherical crystallites with a size of only 3-10nm.
Excellent grinding performance: high removal rate and toughness, with self-sharpening. Compared with single crystal diamond, it is less prone to surface scratches and is more suitable for grinding workpieces with different hardness materials.
As a precision abrasive, it is used for ultra-precision grinding and polishing of sapphire, magnetic heads, hard disks, hard glass and crystals, ceramics, and hard alloys, such as the thinning of LED sapphire.
As a coating additive, it is used for coating of metal molds, tools, parts, etc., which can greatly improve surface wear resistance, surface hardness, and extend service life. It is mainly used for grinding, and is generally formulated as a grinding fluid for use.
It is also possible to make knives, which are not prone to chipping during cutting.
Available Sizes of Polycrystalline Diamond Powder:
| Range | 0-1 | 1-2 | 1-3 | 2-4 | 2-5 | 3-6 | 3-7 | 4-8 | 5-10 | 6-12 | 8-12 |
| HID PD | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate
Characteristics:
Round particle shape, no irregular shapes like pencils or flakes.
Oversizes completely removed.
Narrow PSD.
Surface purity can reach ppm level.
Outstanding dispersibility.
Application for Polycrystalline Diamond Powder HID PD:
Polycrystalline diamond is primarily for high-performance grinding and polishing process. It can be widely used for grinding and polishing of silicon wafer, ruby, sapphire, optical lens, metallographic sample, optical fiber communication and ceramics in IT industry, as well as disc modification, magnetic head polishing and substrate grinding.
Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers
Surface polishing of various ceramics
Surface treatment of metals, such as stainless steel and aluminium alloy.
Workpieces Processing
- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers
- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film
- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror
- Precision cemented carbide, precision ceramics, optical glass and lens, etc.
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