1-2um BRM20 Resin Bond Micron Diamond Powder For Grinding Wheel
1-2um Crush Resistant Resin Bond Diamond Powder Quasi polycrystalline
Description:
The grinding ability of diamond is 1.25 times larger than cubic boron nitride, 2.85 to 3.57 times larger than silicon carbide, and 6.25 to 7.14 times larger than white corundum. Therefore, as a kind of super-hard abrasive, diamond powder has incomparably superior grinding ability, and it has been paid more and more attention by developed countries in various industries. The grinding ability of diamond powder includes the ability to grind the workpiece and its own wear resistance and crush resistance, which depends on its microhardness, particle size, strength, particle shape, and thermal and chemical stability.
In summary, there are three main aspects of the application of diamond powder as an abrasive:
(1) Used for fine grinding or polishing of various precision components in industry, science and medicine;
(2) Used in the manufacture of resin bonding tools, metal bonding tools and electroplating tools;
(3) Used as a fine abrasive for mold processing, gemstone polishing, gem bearing processing and manufacturing.
In addition to being used as an abrasive material, diamond powder is also used as a functional material. For example, use its thermal and electrical properties. By mixing diamond micropowder with thermosetting resin polymer, cellulose, phenolic resin or ceramic sheet, it can be made into a new material with improved thermal conductivity and reduced thermal expansion. Mixing diamond powder into metal sheets, such as nickel sheets or stainless steel sheets, can be made into new sheet materials with high thermal conductivity, low thermal expansion and light weight. In the electronics industry, it can be made into high-density and high-energy devices for thermal control. .
Available Size of Resin Bond Micron Diamond Powder:
| Grade | 0-1 | 0-2 | 1-3 | 2-4 | 3-6 | 4-8 | 5-10 | 6-12 | 8-16 | 10-20 | 12-22 | 15-25 | 20-30 | 22-36 | 30-40 | 36-54 | 40-50 | 40-60 |
| BRM | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| BRM-N30 | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
Particle Size Distribution Specification for Superabrasive Grains
| Size | D10≥(µm) | D50(µm) | D95≤(µm) | Max(µm) | Min(µm) |
| 0-0.25 | 0.1 | 0.170~0.210 | 0.38 | -- | -- |
| 0-0.5 | 0.12 | 0.220~0.280 | 0.51 | --- | -- |
| 0-1 | 0.42 | 0.501~0.580 | 0.795 | 1.156 | 0.375 |
| 0.5-1 | 0.472 | 0.581~0.690 | 1.053 | 1.375 | 0.375 |
| 0.5-1.5 | 0.504 | 0.691~0.871 | 1.298 | 1.945 | 0.375 |
| 0-2 | 0.62 | 0.872~0.985 | 1.542 | 2.312 | 0.446 |
| 1/2 | 0.761 | 0.986~1.224 | 1.894 | 3.27 | 0.63 |
| 0.5-3 | 0.94 | 1.225~1.487 | 2.401 | 3.889 | 0.63 |
| 1/3 | 1.048 | 1.488~1.712 | 2.882 | 4.625 | 0.75 |
| 1.5-3 | 1.169 | 1.713~2.014 | 3.321 | 5.5 | 0.75 |
| 2/3 | 1.392 | 2.015~2.302 | 3.663 | 6.541 | 0.892 |
| 2/4 | 1.644 | 2.303~2.754 | 4.496 | 7.778 | 0.892 |
| 2/5 | 1.803 | 2.755~3.312 | 5.5 | 9.25 | 1.06 |
| 3/6 | 2.448 | 3.313~3.898 | 6.386 | 11 | 1.499 |
| 3/7 | 2.913 | 3.899~4.676 | 7.566 | 13.08 | 1.783 |
| 4/8 | 3.605 | 4.677~5.400 | 8.455 | 15.56 | 2.121 |
| 4/9 | 3.952 | 5.401~6.062 | 9.762 | 18.5 | 2.522 |
| 5/10 | 4.401 | 6.063~6.700 | 10.98 | 18.5 | 2.999 |
| 5/12 | 5.022 | 6.701~7.673 | 12.95 | 22 | 3.566 |
| 6/12 | 5.807 | 7.674~8.549 | 13.97 | 26.16 | 4.241 |
| 7/14 | 6.411 | 8.550~9.483 | 15.13 | 26.16 | 4.241 |
| 8/16 | 7.113 | 9.484~10.78 | 17.82 | 31.11 | 5.044 |
| 8/20 | 8.102 | 10.79~12.56 | 20.6 | 37 | 5.998 |
| 10/20 | 9.186 | 12.57~14.18 | 22.54 | 37 | 7.133 |
| 12/22 | 10.53 | 14.19~16.05 | 24.41 | 44 | 7.133 |
| 12/25 | 12.01 | 16.06~17.65 | 26.61 | 44 | 8.482 |
| 15-25 | 13.32 | 17.66~19.55 | 29.75 | 52.33 | 10.09 |
| 20-30 | 15.04 | 19.56~22.50 | 34.64 | 62.23 | 12 |
| 22-36 | 17.28 | 22.51~26.12 | 39.98 | 74 | 12 |
| 30-40 | 20.11 | 26.13~30.10 | 46.56 | 88 | 14.27 |
| 30-50 | 22.36 | 30.11~34.58 | 52.87 | 88 | 16.96 |
| 36-54 | 25.68 | 34.59~39.00 | 60.94 | 104.7 | 20.17 |
| 40-60 | 29.45 | 39.01~43.20 | 69.86 | 124.5 | 20.17 |
| 50-70 | 32.42 | 43.21~47.50 | 72.65 | 124.5 | 23.99 |
| 54-80 | 36.56 | 47.51~52.50 | 80.74 | 124.5 | 23.99 |
Feature:
Resin bond diamond micron powder with light gray color, blocky shape, friable, multicrystalline struture. Size distribution and shape are controlled tightly. RBM offers excellent performances in polishing and lapping glass, ceramics etc.
Characteristics:
Strong cutting force: There are a large number of sharp cutting edges on the surface of particles, and the cutting force can reach 2-4 times that of single crystal diamond powder.
High polishing accuracy: The cutting edge of single crystal diamond powder is large and hard, which is prone to deep scratches. The cutting edge of polycrystal-like diamond powder is small and its hardness is low. The Ra value of workpiece surface after polishing decreases significantly.
Strong grip strength: rough surface of particles and stronger bonding with binder can significantly improve grip strength of abrasives in various diamond products and improve service life.
Application for Resin Bond Diamond Powder:
Precision lapping and polishing of SiC and Al2O3 wafers;
Grinding and polishing of ceramic materials;
Precision lapping and polishing of stainless steel, aluminium alloy and other metal materials.
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