State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

State-of-the-Art Piezoelectric Wafer Fabrication for MEMS and SAW Devices Advanced Processing Capabilities for Results

   We specialize in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing and fabrication. By simply providing design schematics and specifications, we deliver tailored solutions that meet your exact needs. Our extensive range of wafers includes Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, ensuring versatility for diverse applications.

Advanced Wafer Materials Portfolio‌
Our expertise spans industry-standard and exotic substrates:

• Lithium Niobate (LiNbO₃, 4"-6" wafers)
• Lithium Tantalate (LiTaO₃, Z-cut/Y-cut)
• Single Crystal Quartz (AT-cut/SC-cut)
• Fused Silica (Corning 7980 equivalent)
• Borosilicate Glass (BF33/Schott Borofloat®)
• Silicon (100/111 orientation, 200mm max)
• Sapphire (C-plane/R-plane, 2"–8")

‌Core Fabrication Technologies‌

1. ‌Lithography‌

   • Electron Beam Lithography (EBL, 10nm resolution)
   • Stepper Lithography (i-line, 365nm)
   • Proximity Mask Aligner (5μm alignment accuracy)

2. ‌Etching‌

   • ICP-RIE (SiO₂/Si etch rate 500nm/min)
   • DRIE (Aspect ratio 30:1, Bosch process)
   • Ion Beam Etching (Angular uniformity <±2°)

3. ‌Thin-Film Deposition‌

   • ALD (Al₂O₃/HfO₂, <1nm uniformity)
   • PECVD (SiNₓ/SiO₂, stress-controlled)
   • Magnetron Sputtering (Au/Pt/Ti, 5nm–1μm)

4. ‌Wafer Bonding‌

   • Anodic Bonding (Glass-to-Si, 400°C/1kV)
   • Eutectic Bonding (Au-Si, 363°C)
   • Adhesive Bonding (BCB/SU-8, <5μm warpage)

‌Supporting Process Infrastructure‌

• Precision Grinding (TTV <2μm)
• CMP Polishing (Ra <0.5nm)
• Laser Dicing (50μm kerf width)
• 3D Metrology (White-light interferometry)