2'' to 8'' Polished Silicon Wafer Prime Test Monitor SEMI Standard 50.8mm to 200mm Diameter
Price:
Negotiable
MOQ:
25 Pieces
Delivery Time:
1 - 4 weeks
Brand:
BonTek
Product Description
Polished Silicon Wafers Overview
Polished silicon wafers serve as essential substrate materials across numerous applications, forming the foundation of modern electronics. BonTek provides Prime, Test, Monitor, and SEMI standard silicon wafers in diameters ranging from 2″ to 300mm, with custom options available.
Manufacturing Process
Our silicon wafers are manufactured from ingot using the Czochralski (CZ) crystal growing process, the industry-standard method for producing high-quality semiconductor substrates.
Available Inventory & Shipping
We maintain comprehensive stock of Prime Semi Standard CZ wafers, enabling same-day or next-day shipping for most orders to ensure rapid delivery.
SEMI Standard Specifications
| Parameter | 2" (50.8mm) | 3" (76.2mm) | 4" (100mm) | 5" (125mm) | 6" (150mm) | 8" (200mm) | 12" (300mm) |
|---|---|---|---|---|---|---|---|
| Diameter | 50.8 ± 0.38mm | 76.2 ± 0.63mm | 100 ± 0.5mm | 125 ± 0.5mm | 150 ± 0.2mm | 200 ± 0.2mm | 300 ± 0.2mm |
| Thickness | 279 ± 25µm | 381 ± 25µm | 525 ± 20µm or 625 ± 20µm | 625 ± 20µm | 675 ± 20µm or 625 ± 15µm | 725 ± 20µm | 775 ± 20µm |
| Type | P, N or Intrinsic | ||||||
| Dopant | B, Ph, As or Undoped | ||||||
| Orientation | <100>, <111>, <110> | ||||||
| Resistivity | 0.001 - 300 ohm/cm | ||||||
| Primary Flat Length | 15.88 ± 1.65mm | 22.22 ± 3.17mm | 32.5 ± 2.5mm | 42.5 ± 2.5mm | 57.5 ± 2.5mm | Notch | Notch |
| Secondary Flat Length | 8 ± 1.65mm | 11.18 ± 1.52mm | 18 ± 2.0mm | 27.5 ± 2.5mm | 37.5 ± 2.5mm | NA | NA |
| Surface Finish | SSP, DSP, Etched, or Lapped | ||||||
Product Handling & Acceptance Check
Shipping & Packaging
All products are carefully packaged with fragile labeling and shipped via premium domestic and international carriers to ensure transportation integrity.
Receiving Instructions
Handle with extreme care upon receipt
Inspect outer carton condition thoroughly
Check packaging box alignment before opening
Document packaging condition with photos before removal
Clean Room Protocol
Open vacuum packaging exclusively in clean room environments when products are ready for application.
Damage Reporting Procedure
Immediately photograph or video any damage discovered during transit
DO NOT remove damaged products from packaging boxes
Contact us immediately for resolution
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Hangzhou Freqcontrol Electronic Technology Ltd.
Location
Room 1106, CIBC, No.198 Wuxing Rd, Hangzhou, P.R.China
Contact Person
Xu