Shaanxi Peakrise Metal Co.,Ltd
                                                                                                           
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16 Years
Since 2010
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Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc Tzm Alloy Disc Titanium Zirconium Molybdenum Alloy Disk

Price Negotiable
Price: $5~150/pc
MOQ: 1pc
Delivery Time: 10~15work days
Brand: PRM
Product Description

Mo + 0.40-0.55%Ti + 0.06-0.12%Zr TZM Molybdenum Alloy Disc

 

1. Description of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

 

TZM molybdenum alloy disc is currently the most excellent molybdenum alloy high temperature material. It is a solid solution hardening and particle reinforced molybdenum-based alloy, TZM is harder than pure molybdenum metal, and has a higher recrystallization temperature and better creep resistance, the recrystallization temperature is about 1400 ℃, much higher For molybdenum, it can provide better solderability.

 

2. Size of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

 

Disc diameter : 20-600mm

Disc thickness: 6-25mm

 

Surface: black,C.C,bright,polished

Standard: ASTMB 386

 

Also we can process as per customer's request.

 

 

3. Mechanical properties of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

 
Elongation
/%
Elastic Modulus
/GPa
Yield Strength
/MPa
Tensile Strength
/MPa
Fracture Toughness
/(MP·m1/2)
<20
320
560~1150
685
5.8~29.6

 

4. Actual measured chemical composition of  TZM Molybdenum Alloy Disc:

 
Element Si Mn Ni Cu V Zr O P Fe Mg
Concentration(%) 0.002 0.0009 0.0008 0.0018 0.013 0.086 0.32 0.001 0.0011 0.0015
Element Al Ti Ca C N          
Concentration(%) 0.001 0.5 <0.001 0.012 0.0022          
Purity(Metallic Base) Mo≥99.06%(TZM)

 

5.  Application of Mo+0.4~0.55%Ti+0.06~0.12%Zr TZM Molybdenum Alloy Disc:

 

TZM Molybdenum Alloy Disc mainly used for high-temperature furnace components, crucibles, missiles and other rocket nozzle under high temperature.


TZM Molybdenum Alloy Disc are widely used as contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO’S). Other than in specialist applications, molybdenum is now accepted as the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight.The fact that both materials have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated. Further applications include the use of molybdenum as heat sink bases in IC’S, LSI’S and hybrid circuits.

 


 

 

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Company Shaanxi Peakrise Metal Co.,Ltd
Location No.188 Gaoxin Road,Weibin District Baoji City,Shaanxi,China
Contact Person Nicole

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