Fast PCB Factory Custom Design Fast Lead Time Flexible Circuit Board Flexible PCB Manufacturer

Price Negotiable

Price: USD 1-30 piece

MOQ: 1pcs

Delivery Time: 1-15 working days

Brand: HighLeap

Product Description

Hot Sales Fast PCB Factory Custom Design Fast Lead Time Flexible Circuit Board Flexible PCB Manufacturer Service Manufacturers

FPC PRODUCTION CAPABILITY
Item	Content	Regular Capability	Special
1	Layer	1-6L	Above 8L
2	Max.Array Size	500*600mm	250*1500mm
3	Min.board Size	1-*1mm
4	Max.board thickness	0.23mm	0.4mm
5	Min.board thickness	0.075mm	0.065mm
6	(0.075mm≤T Tolerance±0.03mm	V	575
7	(0.035mm≤T Tolerance±0.05mm	℃	130
8	(0.6mm≤T Tolerance±0.1mm	%(50-260℃)	0.5
9	Max Drill bit Diameter	6.5mm
10	Min Drill bit Diameter	0.20mm	0.15mm
11	Routing tolerance	±0.2mm	±0.15mm
12	Min Base Copper	1/3 OZ	1/4 OZ
13	Max Base Copper	2 OZ	4 OZ
14	Min Coverlay Thickness	1mil(PI0.5mil Adhesive 0.5mil)
15	Max Coverlay Thickness	2mil(PI1mil Adhesive 1mil)
16	Tolerance of holes diameter(PTH)	±0.05mm
17	Tolerance of holes diameter(NPTH)	±0.025mm
18	Hole Position Deviation(hole to hole compared with the CAD data)	±0.05mm
19	Hole Position Deviation(copper foil to hole compared with the CAD data)	±0.07mm
20	PTH wall copper thickness	12-18um
21	Minimum Trace Width/Space	1/3OZ Cu 1L 50/60um 1/2OZ 2L 70/80um 1OZ Cu 1L 70/80um 1OZ Cu 2L 80/90um
22	Min distance copper foil to the edge	±0.10mm	±0.07mm
23	Offset tolerance of silk character	±0.3mm	±0.2mm
24	Soldermask printing offset tolerance	Photo sensitive:±0.1mm(±4mil) Printed backing:±0.3mm(±8mil)	±0.075mm ±0.2mm
25	Soldermask thickness	Photo sensitive:0.007-0.02mm(0.3-0.8mil) Printed backing:0.01-0.025mm(0.4-1mil)
26	Protective film alignment accuracy(joint offset tolerance)	±0.15mm	±0.10mm
27	Min protective film lamination spilled glue amount	0.5mil Adhesive≤0.1mm(4mil) 1mil Adhesive≤0.15mm(6mil)
28	Tin thickness(Max),(Min)/Tolerance	(0.2mil)-(2.0mil)±0.30mm
29	Gold plating, Ni thickness(Gold finger or other parts)	1-6 u inch	Min 30 u inch Max 280 u inch
30	Gold plating, Au thickness(Gold finger or other parts)	1-6u inch	1-10 u inch
31	ENIG Ni/Au thickness(Gold finger or other parts)	Ni:30-150u inch Au:±1u inch	4 u inch
32	(OSP)	0.2-0.8um
33	Die Punching Min hole/tolerance	Min:0.5mm/±0.05mm	+0.06/-0mm
34	Alignment tolerance of manual joint operation	±0.30mm	±0.2
35	Alignment tolerance of fixture joint operation	±0.15mm