Guangzhou Highleap Electronic Co.,Ltd.  
                                                                                                           
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China FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication for sale

FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

Price Negotiable
Price: USD 1-30 piece
MOQ: 1pcs
Delivery Time: 1-15 working days
Brand: HighLeap
Product Description

 

Multilayer PCB
Special Tech
Place of Origin:
China
 
 
 
 
1.Impedance

2.Via Filling

3.PFH,Backdrill

4.Mix Finishes

5.Cave

6.Heatsink

7.ENEPIG
Brand Name:
Highleap
Application Segment:
Auto,Industrial,Medical,DataCom,Consumer
Layer Count:
4~50L
Matierial:
FR4 (Tg130~Tg170)
Board Thickness(mm):
0.6mm~10.0mm
Copper Thickness(oz):
Hoz~3oz
Size(mm):
5mm~1200mm
Min. LW/LS(mm):
0.1/0.1
Min. Hole(mm):
0.25
Solder Mask:
Green, Yellow, Blue, Black, White...
Surface Finish:
ENIG,OSP,HASL,Imm Tin,Imm Silver...
Certificate:
RoHS/ISO9001/ISO14001
Service:
OEM
 
About HighLeap Electronic
Advantages of HighLeap Electronic
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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Guangzhou Highleap Electronic Co.,Ltd.  
Location Room 1306, building 2, No. 96, Lixin 12 road, Xintang Town, Zengcheng District, Guangzhou
Contact Person Howard

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