China SGS FCC FR4 High TG Medical PCB Assembly Electronic Circuit Assembly for sale

SGS FCC FR4 High TG Medical PCB Assembly Electronic Circuit Assembly

Price Negotiable

Price: USD 1-30 piece

MOQ: 1pcs

Delivery Time: 1-15 working days

Brand: HighLeap

Product Description

FR4 High TG medical pcb assembly electronic circuit assembly

Our Advantages:

1.Program and functional test and package by Free. 2.High yield :IPC-A-610E standard,E-test,X-ray,AOI test,QC,100% functional

test. 3.Professional service:PCB&PCBA+SMT+DIP+AOI+Component Sourcing,12 years experience Professional PCBA manufacturing factory,

One-stop service from empty board to finished board.4.Certifications:94v-0,CE,SGS,FCC,RoHS,ISO9001 5.The warranty period for PCBA:

2 year. 6.About Factory: 6 SMT Lines,4 DIP Lines, 1 X-ray,16 AOI,2 Sample test machines,4 finished product assembly lines.

PCB&PCBA Capacity:

			1

			Material

			FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI

			Material, BT Material, PPO, PPE etc.

			2

			Board thickness Mass production

			394mil(10mm) Samples: 17.5mm.

			3

			Surface finish

			HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger.

			4

			PCB Max panel size

			1150mm × 560mm

			5

			Layer

			Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers.

			6

			Min hole size

			Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

			7

			PCBA QC

			X-ray, AOI Test, Functional Test

			8

			Special Process

			Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

			9

			Our service

			PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers.

			10

			Sanforized

			Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.

			11

			SMT Capacity

			5Million Points/Day

			12

			DIP Capacity

			0.35Million Points/Day

			13

			Certificate

			94v-0,CE,SGS,FCC,RoHS,ISO9001.

About HighLeap Electronic

Advantages of HighLeap Electronic

Our PCB Equipments

Our Certifications

FAQ

Q1.What is needed for PCB PCBA quotation?A: PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)

PCBA: PCB information, BOM, (Testing documents...)
Q2. What file formats do you accept for PCB PCBA production?A: Gerber file: CAM350 RS274X PCB file: Protel 99SE, P-CAD 2001 PCB 
BOM: Excel (PDF,word,txt)
Q3. Are my files safe?A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process..

All documents from customers are never shared with any third parties.
Q4. MOQ?A: No MOQ. We are able to handle Small as well as large volume production with flexibility.
Q5.Shipping cost?A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Guangzhou Highleap Electronic Co.,Ltd.

Location Room 1306, building 2, No. 96, Lixin 12 road, Xintang Town, Zengcheng District, Guangzhou

Contact Person Howard

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1	Material	FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc.
2	Board thickness Mass production	394mil(10mm) Samples: 17.5mm.
3	Surface finish	HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger.
4	PCB Max panel size	1150mm × 560mm
5	Layer	Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers.
6	Min hole size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7	PCBA QC	X-ray, AOI Test, Functional Test
8	Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9	Our service	PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers.
10	Sanforized	Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11	SMT Capacity	5Million Points/Day
12	DIP Capacity	0.35Million Points/Day
13	Certificate	94v-0,CE,SGS,FCC,RoHS,ISO9001.