Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Hot Sale Factory Direct 100% Solid White Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-108 for Edge Bonding with High Bonding Strength
Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.
APPLICATION
Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | White Solid Particles |
| Component | EVA |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 180℃～200℃( Depend On Machine, Substrate, Environment And Other Conditions). |
| Softening Temperature | 95℃~105℃ |
| Melt Viscosity | 70000±10000mpa·s (200℃) |
| Curing | Normal Temperature Curing |
| Usage Scope | Edge Bonding of Wood Materials- Chip Board |
| Shelf Life | 2 * Years |
| Package | 25Kg/Bag |
FEATURE
High bonding strength, lower cost and fast curing
USER GUIDE
The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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