Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.
Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory White Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions) |
| Melt Viscosity | About 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials - Chip Board |
| Shelf Life | 6 Months |
| Package | 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Very good initial adhesion.
Suitable opening time.
High final bonding strength.
USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
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