Chip White EVA Hot Melt Adhesives Book Binding Industrial EVA-KG-6D
Hot Sale Good Quality & Low Cost, Viscosity 7000±1000mpa·s (@160℃) White Chips Bulk WANLI® KG-6D EVA Hot Melt for Book Back Binding at Paper Weight of 50-60G/m²
Wanli® EVA hot melt adhesive KG-6D for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-6D is developed for book wireless binding. KG-6D is featured good bonding strength, fast curing, low cost, suitable for automatic hot melt glue binding book production line.
APPLICATION
Wanli® EVA hot melt adhesive KG-6D is used for book back wireless bonding. KG-6D is suitable for paper with a weight of 50-60G/m².
| Application Material | Book Back Wireless Binding Adhesives |
| Appearance | White Chips / 100% Solid |
| Component | EVA |
| Application Industry | EVA Hot Melt Adhesive for Book Back Binding |
| Solid Content | 100% |
| Operating Temperature | 150℃～170 ℃(Depend On Substrate, Equipment, Environment And Other Conditions) |
| Softening Temperature | 80±5 ℃ |
| Melt Viscosity | 7000±1000mpa·s (160℃) |
| Usage Scope | For Paper With A Weight Of 50-60G/m² |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
Good bonding strength.
Fast curing.
Low cost.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The bulk package of KG-6D is suitable for all kinds of dispensing equipment.
The recommended operating temperature is 150~170℃, that depends on the substrate, equipment, environment and other conditions.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
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