3D Lamination EVA Hot Melt Adhesive Edgebanding Chip Board Woodworking EVA-JF-202
Good Quality Factory Directly EVA Hot Melt Adhesive WANLI® EVA-JF-202 with Soften Temperature 93±5 ℃ for Edge Bonding of Various Kinds of Substrates to Various Kinds of Surface Materials
Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for edgebanding bonding of chip board to various kind of edge band and 3D lamination bonding of chip board to various kinds of decorative paper. It is featured lower cost, high bonding strength and fast curing.
APPLICATION
Wanli® EVA hot melt adhesive JF-202 is used for edgebanding bonding of chip board to various kind of edge band and 3D lamination bonding of chip board to various kinds of decorative paper.
| Application Material | Woodworking 3D Lamination & Edgebanding Hot Melt Adhesives |
| Appearance | Round yellow particles |
| Component | EVA |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 170～190 ℃( Depend On Machine, Substrate, Environment And Other Conditions). |
| Softening Temperature | 93±5 ℃ |
| Melt Viscosity | 11500±1500mpa·s (180℃) |
| Curing | Normal Temperature Curing |
| Usage Scope | 3D lamination and edgebanding |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
Lower cost, high bonding strength and fast curing
USER GUIDE
The package of JF-202 is suitable for various dispensing equipment. Especially for high-speed automatic 3D lamination machines. Recommended dosage is 40～80g/㎡. Recommended sizing temperature is 180±10℃. Recommended tank temperature is 180±10℃.
STORAGE
Storage temperature should be 5~25℃, humidity less than 70% RH, please pay attention to avoid direct sunlight, FIFO.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.