3D Lamination Woodworking Hot Melt Adhesive Edgebanding Chip Board EVA-JF-202
Low Cost & High Quality Factory Directly 100% Solid Yellow Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-202 for Various Kinds of Substrates Edge Bonding Application
Wanli® EVA hot melt adhesive EVA-JF-202 for wrapping & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for wrapping bonding of chip board to various kinds of surface materials and edgebanding bonding of chip board to various kind of edge band. It is featured high bonding strength, lower cost and fast curing.
APPLICATION
Wanli® EVA hot melt adhesive EVA-JF-202 is used for wrapping bonding of chip board to various kinds of decorative materials and edgebanding bonding of chip board to various kind of edge band.
| Application Material | Woodworking Wrapping & Edgebanding Hot Melt Adhesives |
| Appearance | Round yellow particles |
| Component | EVA |
| Application Industry | Woodworking Wrapping & Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 170～190 ℃( Depend On Machine, Substrate, Environment And Other Conditions). |
| Softening Temperature | 88~98 ℃ |
| Melt Viscosity | 10000~13000mpa·s (180℃) |
| Curing | Normal Temperature Curing |
| Usage Scope | Wrapping and edgebanding |
| Shelf Life | 2 Years |
FEATURE
High bonding strength, lower cost and fast curing
USER GUIDE
The package of EVA-JF-202 is suitable for various dispensing equipment. Especially for high-speed automatic 3D lamination machines. Recommended sizing temperature is 170～190℃. Recommended tank temperature is 170～190℃. Recommended dosage is 40～80g/㎡.
STORAGE
Storage temperature should be 5~25℃, humidity less than 70% RH, avoid direct sunlight, FIFO.
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