China Manufactory Yellow Solid WANLI® Moisture Reactive Hot Melt Adhesive PUR-XBB719 for Flat Lamination Bonding of Fireproof Board Air Duct Application Perfect Initial & Final Bonding Strength, Excellent Heat & Moisture Resistance

Wanli® PUR hot melt adhesive PUR-XBB719 for flat lamination bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB719 can be used for flat lamination bonding of metal plates, plastics, paper products, wood-plastic boards, medium density boards, etc. PUR-XBB719 is featured stable viscosity under heating at a certain temperature, very high initial bonding strength and final strength. After curing, PUR-XBB719 has good peel strength, good heat and humidity resistance and chemical resistance.

APPLICATION

Wanli® PUR hot melt adhesive PUR-XBB719 is used for flat lamination bonding. PUR-XBB719 is mainly used for flat lamination bonding of metal plates, plastics, paper products, wood-plastic boards, medium density boards, etc.

FEATURE

Stable viscosity under heating at a certain temperature.

Very high initial bonding strength and final strength.

PUR-XBB719 has good peel strength, good heat and humidity resistance and chemical resistance after curing.

USER GUIDE

The package of PUR-XBB719 is suitable for various dispensing equipment.

The recommended operating temperature is 140℃~160℃.

In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.