Factory Hot Sale Hot Melt Adhesives PUR-8830 used for Electrical Structural Bonding with 100% solid

Wanli® PUR hot melt adhesive PUR-8830 for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8830 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8830 is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, PUR-8830 has good peeling strength, good heat&humidity resistance and chemical resistance. PUR-8830 is especially suitable for bonding applications in the electronic industry.

APPLICATION

Wanli® PUR hot melt adhesive PUR-8830 is used for electronics structural bonding. PUR-8830 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8830 is especially suitable for bonding applications in the electronic industry.

FEATURE

Stable viscosity under heating at a certain temperature.

High initial bonding strength and final bonding strength.

After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance.

USER GUIDE

The package of PUR-8830 is suitable for various dispensing equipment.

The recommended operating temperature is about 110℃.

In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.