Hot Sale Factory Direct Earphone Assembly Bonding Hot Melt Adhesives PUR-8860H

Wanli® hot melt adhesive PUR-8860H for earphone assembly bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8860H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless-steel and other metals. PUR-8860H is characterized by stable viscosity when heated at a certain temperature and high initial and final bonding strength. PUR-8860H has good peeling strength, good heat&humidity resistance and chemical resistance when it is cured. It is especially suitable for bonding applications in the electronic industry.

APPLICATION

Wanli®  hot melt adhesive PUR-8860H can be used for bonding of headphone components. PUR-8860H is usually used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless-steel and others. PUR-8860H is suitable for bonding applications in electronics industry.

FEATURE

Stable viscosity under heating at a certain temperature.

Good initial bonding strength and final bonding strength.

It has good peeling strength, good heat&humidity resistance and chemical resistance after curing.

USER GUIDE

The package of PUR-8860H can be used with various dispensing equipment.

The recommended working temperature is about 110°C.

Fot fully curing, please place finished product in a working environment with suitable temperature and humidity (recommended temp: 23~25℃, about 65% relative humidity).

STORAGE

Store the product where it’s dry, cool and please take note to avoid direct sunlight. The storage temperature should not exceed 35℃ and avoid open flame or heat source.