Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768
Hot Sale High Quality PUR(Polyurethane) Reactive Hot Melt Adhesive WANLI® PUR-XBB768 with Viscosity About 55000mPa·s@120℃(Brookfield-ASTMD3236) for Edge Bonding of Wood Materials, Foam Boards, And Some Aluminum Substrates Application
Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
| Application Material | Woodworking Edgebanding PUR Hot Melt Adhesives |
| Appearance | Ivory White Solid |
| Component | PUR(Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100 % |
| Operating Temperature | 120~140℃ |
| Melt Viscosity | Around 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8-15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials-Chip Board |
| Shelf Life | 6Months |
| Package | 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Good initial adhesion.
Suitable opening time.
High bonding strength
USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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