Chinese Factory 100% White Solids Reactive PUR Hot Melt Adhesive WANLI® PUR-7563A with Visosity About 65000cps@120℃ for Density Board Edge Banding

Wanli® PUR hot melt adhesive PUR-7563A for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It is a cleaning free glue, which is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates. It is featured stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.

APPLICATION
Wanli® PUR hot melt adhesive PUR-7563A is used for edge bonding. It is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates.
 

 FEATURE
Stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.
 
USER GUIDE
The package of PUR-7563A is suitable for various dispensing equipment. The recommended operating temperature is 120℃~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).
 
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.