Edgebanding Hot Melt Adhesives Density Board -PUR-XBB768 Ivory Solid
Manufactory Direct Ivory White & Solid Moisture-Reactive Hot Melt Adhesive WANLI® PUR-XBB768 with Open Time 8~15 Seconds at 25℃, for Edge Bonding of Density Board Application
Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. It is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. It is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions) |
| Melt Viscosity | About 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Material s- Density Board |
| Shelf Life | 6 Months |
| Package | 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Good initial adhesion, suitable opening time, high bonding strength
USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment. The recommended operating temperature is 120℃~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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