Hot Sale Factory Direct Moisture-Curing Reactive PUR Hot Melt WANLI® PUR-UH168.5A with Open Time 2~5min@25℃ for Wrapping Bonding of SPC Panels, WPC Panels And Wall Panels

Wanli® PUR hot melt adhesive UR-UH168.5A for 3D lamination bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It is mainly used for the cladding bonding of substrates such as stone-plastic panels, wood-plastic panels and wall panels with PVC materials with excellent bonding strength. It is featured good initial adhesion, high bonding strength, good fluidity, good thermal stability and handling properties, good humidity and weather resistance.

APPLICATION

Wanli® PUR hot melt adhesive UR-UH168.5A is used for 3D lamination bonding. It is mainly used for the cladding bonding of substrates such as stone-plastic panels, wood-plastic panels and wall panels with PVC materials with excellent bonding strength.

FEATURE

Good initial adhesion, high bonding strength, good fluidity, good thermal stability and handling properties, good humidity and weather resistance.

USER GUIDE

The package of UR-UH168.5A is suitable for various dispensing equipment. It is recommended to use at an ambient temperature more than 15℃The recommended operating temperature is 120~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.