Lamination Pressure Sensitive Adhesives Floor Mute Pad Construction Hot Glue TPR-2003
Chinese Factory 100% Yellow Solid Block PSA Hot Melt Adhesive WANLI® TPR-2003 with Peeling Strength About 30N (2.5cm*45μm on Stainless Steel Plate @180˚) for Mute Pad Flat Lamination Bonding During Flooring Production
Wanli® pressure sensitive hot melt adhesive TPR-2003 for woodworking flat lamination is a TPR(Thermoplastic Rubber) synthetic rubber based hot melt adhesive. TPR-2003 is specifically developed for floor mute pad lamination bonding. TPR-2003 is featured high viscosity, high peeling strength, good aging resistance.
APPLICATION
Wanli® PSA pressure sensitive hot melt adhesive TPR-2003 is used for floor mute pad lamination bonding.
| Application Material | Floor Mute Pad Lamination Bonding Hot Melt Adhesives |
| Appearance | Yellow Solid Block |
| Component | TPR |
| Application Industry | Woodworking Flat Lamination Bonding |
| Solid Content | 100% |
| Operating Temperature | 150～180 ℃( Depend On Machine, Substrate, Environment And Other Conditions) |
| Softening Temperature | About 108℃ |
| Melt Viscosity | About 16000mpa·s (160℃) About 7500mpa·s (180℃) |
| Peeling @180˚ | About 30.0N/2.5cm/45μm/ Stainless Steel Plate |
| Lasting Adhesive | ≥72H |
| Usage Scope | Floor Mute Pad Lamination |
| Shelf Life | 1 Year |
| Package | 20Kg/Carton |
FEATURE
High viscosity.
High peeling strength.
Good aging resistance.
USER GUIDE
TPR-2003 is suitable for standard hot melt adhesive application equipment such as slit squeegee, roll glue etc.
The recommended operating temperature is 150℃~180℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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