Floor Mute Pad Hot Melt Pressure Sensitive Adhesives TPR Heat Glue TPR-2005AC
Good Quality Factory Directly Floor Mute Pad Flat Lamination Bonding Yellow Solid Block PSA Hot Melt Adhesive WANLI® TPR-2005AC with Peeling Strength About 27.0N (under 2.5cm*45μm on Stainless Steel Plate @180˚)
Wanli® pressure sensitive hot melt adhesive TPR-2005AC for woodworking flat lamination is a TPR(Thermoplastic Rubber) synthetic rubber based hot melt adhesive. TPR-2005AC is specifically developed for mute pad flat lamination bonding to flooring. TPR-2005AC is featured high viscosity, good peeling strength, excellent aging resistance.
APPLICATION
Wanli® PSA pressure sensitive hot melt adhesive TPR-2005AC is used for mute pad flat lamination bonding to flooring.
| Application Material | Floor Mute Pad Flat Lamination Bonding Hot Melt Adhesives |
| Appearance | Yellow Lump |
| Component | TPR |
| Application Industry | Pressure Sensitive Hot Melt Adhesive for Woodworking Flat Lamination Bonding |
| Solid Content | 100% |
| Operating Temperature | 150℃～180℃( Depend On Equipment, Substrate, Environment And Other Conditions) |
| Softening Temperature | About 100℃ |
| Melt Viscosity | About 12500mpa·s (@160℃) & Around 5600mpa·s (@180℃) |
| Peeling @180˚ | About 27.0N (2.5cm/45μm on Stainless Steel Plate) |
| Lasting Adhesive | More Than 72H |
| Usage Scope | Floor Mute Pad Flat Lamination |
| Shelf Life | 1 Year |
| Package | 20Kg/Carton Box |
FEATURE
High viscosity.
Good peeling strength.
Excellent aging resistance.
USER GUIDE
TPR-2005AC is suitable for standard hot melt adhesive application equipment such as slit squeegee, roll glue etc.
The recommended operating temperature is 150℃~180℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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