Book Binding EVA Hot Melt Adhesives Solid Flaky Compostable EVA-KG-8
Chinese Manufactory WANLI® KG-8 White Chips Solid Bulk EVA Hot Melt for Book Back Binding with Paper Weight ≤105G/m²
Wanli® EVA hot melt adhesive KG-8 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-8 is specifically developed for book wireless binding. KG-8 is featured high bonding strength, fast curing, suitable for automatic hot melt glue binding book production line.
APPLICATION
Wanli® EVA hot melt adhesive KG-8 is used for book back wireless bonding. KG-8 is suitable to be used on papers with a weight of ≤105G/m².
| Application Material | Book Back Binding Adhesives |
| Appearance | White Chips Solid |
| Component | EVA |
| Application Industry | Book Back Binding Adhesives |
| Solid Content | 100% |
| Operating Temperature | 160～180 ℃(Depend On Machine, Substrate, Environment And Other Conditions) |
| Softening Temperature | 95±5 ℃ |
| Melt Viscosity | 6500±1000mpa·s (160℃) |
| Usage Scope | For Paper With A Weight Of ≤105G/m² |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
High bonding strength.
Fast curing.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The package methods of Wanli® EVA hot melt adhesive KG-8 is suitable for almost all kinds of dispensing equipment. The recommended operating temperature is 160~180℃, which depends on the substrate, equipment, environment and other conditions.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
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