10~15Second Edgebanding Hot Melt Adhesives Solid PUR Glue PUR-XCS637
New Hot Selling & Low Cost WANLI® PUR-XCS637 Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding Application And Provides Invisible Glueline
Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XCS637 is a translucent natural color edge bonding glue, which is mainly used for edge bonding of solid wooded materials(chip board) to various surface materials. PUR-XCS637 is featured high initial tack, short open time, high bond strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XCS637 is used for edge bonding. PUR-XCS637 is mainly used edge bonding of solid wooded materials(chip board) to various surface materials.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 120~140 ℃ |
| Melt Viscosity | About 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 10~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials - Chip Board |
| Shelf Life | 6 Months |
| Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
High initial tack.
Short open time.
High bond strength.
USER GUIDE
The package of PUR-XCS637 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
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