Chip Woodworking Edgebanding Hot Melt Adhesive Ivory PUR Glue PUR-7562.1
Good Quality Factory Directly WANLI® PUR-7562.1 Ivory 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding During High Quality Furniture Production
Wanli® PUR hot melt adhesive PUR-7562.1 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to various surface materials. PUR-7562.1 is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-7562.1 is used for edge bonding. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to various surface materials.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory / Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Reactive PUR Hot Melt Adhesive for Woodworking Edgebanding |
| Solid Content | 100 Percent |
| Operating Temperature | 120~140 ℃ |
| Melt Viscosity | About 75000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials- Chip Board |
| Shelf Life | 6 Months |
| Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Very good initial adhesion.
Suitable opening time.
High bonding strength.
USER GUIDE
The package of PUR-7562.1 is suitable for various dispensing equipment. The recommended operating temperature is 120℃~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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