TPR-2003 Flat Lamination Hot Melt Adhesives Floor Mute Pad Bonding
Manufactory Direct & Low Cost Pressure Sensitive Hot Melt Adhesives Used for Flooring Mute Pad Flat Lamination Bonding, WANLI® TPR-2003 with Lasting Adhesive More Than 72 Hours
Wanli® pressure sensitive hot melt adhesive TPR-2003 for woodworking flat lamination is a TPR(Thermoplastic Rubber) synthetic rubber based hot melt adhesive. TPR-2003 is specifically developed for floor mute pad lamination bonding. TPR-2003 is featured high viscosity, high peeling strength, good aging resistance.
APPLICATION
Wanli® PSA pressure sensitive hot melt adhesive TPR-2003 is used for floor mute pad lamination bonding.
| Application Material | Floor Mute Pad Lamination Bonding Hot Melt Adhesives |
| Appearance | Yellow Solid Lump |
| Component | TPR |
| Application Industry | Woodworking Flat Lamination Bonding |
| Solid Content | 100% |
| Operating Temperature | 150～180 ℃ |
| Softening Temperature | About 108℃ |
| Melt Viscosity | About 16000mpa·s (@160℃) & About 7500mpa·s (@180℃) |
| Peeling @180˚ | About 30.0N ( @ 2.5cm*45μm on Stainless Steel Plate |
| Lasting Adhesive | More Than 72H |
| Usage Scope | Floor Mute Pad Flat Lamination |
| Shelf Life | 1 Year |
| Package | 20Kg/Carton Box |
FEATURE
High viscosity.
High peeling strength.
Good aging resistance.
USER GUIDE
TPR-2003 is suitable for standard hot melt adhesive application equipment such as slit squeegee, roll glue etc.
The recommended operating temperature is 150℃~180℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
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