Hot Rolling Molybdenum Copper Alloy Heat Sink For LED Packaging And Electronics
Molybdenum copper heat sink materials for LED packaging and electronics and semiconductor industries
Product description
With the development of electronic technologies, the heating of components has increasingly become a bottleneck of their functions and service life. With constant improvement of functional efficiency of electronic elements and constant decrease of their volumes, thermal management of electronic systems has encountered severe challenges. Insufficient heat dissipation will cause bad influences on the efficiency and reliability of semiconductors. More than a half of electronic elements going wrong are caused by excessive heat. Electronic elements mounted on substrates can dissipate heat effectively only by a heat sink effect, thus stabilizing the operating temperature.
MoCu
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Product Specification
| Type | Composition | Properties | ||||
| element | Content wt% | Density | CTE ppm/K |
TC, W/m·K |
||
| Mass density, g/cm3 | Relative density, %T.D | |||||
| Mo70Cu30 |
Mo Cu |
70±1 balance |
9.7 | ≥99 | 7.6~8.5 | 190~200 |
| Mo60Cu40 |
Mo Cu |
60±1 balance |
9.6 | ≥99 | 9.2~9.4 | 200~220 |
| Mo50Cu50 |
Mo Cu |
50±1 balance |
9.5 | ≥99 | 10.2~10.5 | 220~250 |
CuMoCu
CMC(Cu/Mo/Cu) is a 3-layer-structure material. The chip is MoCu or Mo, coated with Cu. Thanks to the lower heat expansion coefficient and far better heat conductivity than WCu and MoCu, the high power electronic components to provide better alternative and help cooling high-power IGBT modules and other components
| Type material | material | density (g/cm³) |
Coefficient of thermal conductivity W/mK |
Coefficient of thermal expansion 10-6/K |
| Copper Metal laminate | 1:1:1 Cu/Mo/Cu |
9.32 | 305(xy)/250(z) | 8.8 |
| 1:2:1 Cu/Mo/Cu |
9.54 | 260(xy)/210(z) | 7.8 | |
| 1:3:1 Cu/Mo/Cu |
9.66 | 244(xy)/190(z) | 6.8 | |
| 1:4:1 Cu/Mo/Cu |
9.75 | 220(xy)/180(z) | 6 | |
| 13:74:13 Cu/Mo/Cu |
9.88 | 200(xy)/170(z) | 5.6 |
Product detail
Features
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available
Advantages
This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Applications
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
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