Advanced Microelectronic Materials of molybdenum copper Mo-Cu electronic heat sink package

Product  description

With constant improvement of functional efficiency of electronic elements and constant decrease of their volumes, thermal management of electronic systems has encountered severe challenges. Insufficient heat dissipation will cause bad influences on the efficiency and reliability of semiconductors. More than a half of electronic elements going wrong are caused by excessive heat. Electronic elements mounted on substrates can dissipate heat effectively only by a heat sink effect, thus stabilizing the operating temperature.

Tungsten-molybdenum and alloy materials have the following features:

Thermal expansion coefficients matched with those of sapphire substrates, silicon slices, gallium arsenide, ceramics and other materials;

Therefore, tungsten-molybdenum materials including pure molybdenum, molybdenum-copper, tungsten-copper and copper-molybdenum-copper (CMC) used for heat sink are used in LED packaging and electronic packaging in large quantity.

Molybdenum copper

Specifications

Features

As a pseudo-alloy, Mo-Cu alloy is composed of molybdenum and copper that not melt in solid solution, and integrated each others. It is characterized by high thermal conductivity, low and adjustable coefficient of thermal expansion, non-magnetic, low gas content, good vacuum performance, good machining ability and outstanding properties in high temperature. It is widely used in machinery, electric power, electronics, electric vehicle,metallurgy and other industries

Product detail

Specification: Bared and coated with Nickle, gold.

Tungsten copper

Specifications

Features

With the 6~50% copper(by weight), the W-Cu alloy has integrated both advantages of tungsten and copper. Characterized by good high temperature resistance, arc ablation resistance, thermal and electrical conductivity , high strength, machining-ease, and outstanding sweat cooling ability and specific gravity ,it is widely applied in machinery, electric power, electronics, metallurgy, aerospace and other industries.

Product  detail 

Specification: bared, coated with nickel and gold

Cu/MoCu/Cu,Cu/Mo/Cu

Advantage:

CMCC(Cu/MoCu/Cu) and CMC(Cu/Mo/Cu) is a 3-layer-structure material. The chip is MoCu or Mo, coated with Cu. Thanks to the lower heat expansion coefficient and far better heat conductivity than WCu and MoCu, the high power electronic components to provide better alternative and help cooling high-power IGBT modules and other components

Specification:

We can provide all kinds of products with different thickness and layers to meet customers various requirements.

Typical properties table of heat sink products