Custom ESD Carrier Tape & Mold Tooling for Electronic Packaging
Custom‑Made Carrier Tape Including Mold Development
The SMD Carrier Tape with Custom Tooling & Mold is a customized packaging solution developed for electronic components that require dedicated pocket geometry. The tooling is designed according to the component's dimensions and packaging requirements, allowing the carrier tape pocket to closely match the shape and size of the packaged part.
The customization process starts with the customer's component drawing, dimensions or physical sample. Based on these specifications, the pocket geometry and forming tooling are developed before carrier tape production. This approach allows the final tape to be produced with the required pocket width, length, depth and pitch.
The solution is suitable for components with non-standard dimensions or packaging requirements, including SMD resistors, capacitors, LEDs, ICs, connectors, sensors and semiconductor devices.
A complete project can include custom mold/tooling development, carrier tape production, sample verification and mass production, providing a convenient solution for customers who need both tooling and finished carrier tape.
| Tooling Item | Description |
|---|---|
| Tooling Purpose | Carrier Tape Pocket Forming |
| Design Input | Component Drawing / 3D Data / Product Dimensions / Sample |
| Pocket Geometry | Designed according to component shape |
| Pocket Dimensions | Customized |
| Tooling Precision | Designed according to carrier tape requirements |
| Prototype Sample | Available for Verification |
| Tooling Modification | Available if Required |
| Tooling Ownership | Subject to Project Agreement |
| Production Application | Customized Carrier Tape Manufacturing |
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