High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials

Price Negotiable

Price: 200-500 yuan/kg

MOQ: Negotiable

Delivery Time: Negotiable

Brand: KEGU

Product Description

High-Purity Spherical Alumina Powder - White D50 Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials

This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic composites, and electronic packaging applications.

High-purity spherical alumina powder sample

Technical Specifications

Available Particle Size Distributions

Type	D50 (μm)	Specific Surface Area (m²/g)
SA-05	5 ± 1	0.60
SA-10	10 ± 2	0.50
SA-20	20 ± 3	0.40
SA-30	30 ± 3	0.30
SA-40	40 ± 5	0.20
SA-70	70 ± 6	0.12

Physical Properties

Appearance: White free-flowing powder
Specific Gravity: 3.60 g/cm³
Melting Point: 2050°C
Moisture Content: ≤ 0.05%
Electrical Conductivity: ≤ 10 μS/cm
pH Value: 7.0 ± 0.5
α-Al₂O₃ Content: ≥ 90%
Sphericity Ratio: ≥ 95%

Chemical Composition (All Types)

Al₂O₃: ≥ 99.0%
SiO₂: ≤ 0.05%
Fe₂O₃: ≤ 0.05%
Na₂O: ≤ 0.02-0.03%
Other Oxides (K₂O, MgO, CaO): ≤ 0.01-0.02%

Key Performance Characteristics

High Packing Density: Optimized particle size distribution enables dense packing in polymers and ceramics, resulting in compounds with lower viscosity and improved flow characteristics
Enhanced Thermal Conductivity: Superior packing efficiency creates effective heat transfer pathways, enabling formulation of high thermal conductivity composites (2-10 W/m*K) that outperform conventional crystalline silica fillers
Reduced Equipment Wear: Perfect spherical morphology minimizes abrasion to processing equipment, extending service life of mixing, molding, and extrusion machinery
Excellent Electrical Properties: Low moisture content and electrical conductivity make it suitable for demanding electronic applications

Primary Applications

Thermal Management Materials: Fillers for thermal grease, phase change materials, thermal pads, heat sink composites, and MC (Metal Core) PCB thermal filling compounds
Electronic Packaging: Semiconductor encapsulation resins, silicone-based thermal adhesives, and potting compounds for electronic components
Advanced Ceramics & Composites: Ceramic molding compounds, high-performance refractory materials, and technical ceramic formulations

Competitive Advantages

Superior Sphericity (>95%) for optimal flow and packing
High Purity (99% Al₂O₃) for demanding applications
Controlled Particle Size distributions for specific formulation needs
Proven Performance in thermal interface materials and electronic composites

Looking to enhance your material's thermal performance? Contact our technical team for product samples and application guidance tailored to your specific requirements.